2011
DOI: 10.1016/j.actamat.2011.01.039
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Microstructure formation in electrodeposited Co–Cu/Cu multilayers with GMR effect: Influence of current density during magnetic layer deposition

Abstract: The influence of the current density applied during the deposition of the magnetic layers on the microstructure formation in electrodeposited Co-Cu/Cu multilayers and on their giant magnetoresistance (GMR) was investigated using a combination of magnetoresistance measurements, wide-angle and small-angle X-ray scattering, high-resolution transmission electron microscopy, atomic force microscopy and chemical analysis. The magnetoresistance measurements revealed that a reduction of the current density stimulates … Show more

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Cited by 27 publications
(60 citation statements)
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“…1 and 2 in order to deduce the experimental bilayer length XRD and the results are summarized in Fig. 3 Co/Cu multilayers, 26 including also data derived with the help of a more sophisticated full-profile fitting procedure 13,14 or even direct cross-sectional TEM imaging.…”
Section: Results On Multilayers With Cu Layers Depositedmentioning
confidence: 99%
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“…1 and 2 in order to deduce the experimental bilayer length XRD and the results are summarized in Fig. 3 Co/Cu multilayers, 26 including also data derived with the help of a more sophisticated full-profile fitting procedure 13,14 or even direct cross-sectional TEM imaging.…”
Section: Results On Multilayers With Cu Layers Depositedmentioning
confidence: 99%
“…It should be noted that for G/P multilayers deposited at E EC Cu , the actual layer thicknesses correspond fairly well to the nominal values as determined above which was evidenced from detailed XRD studies. 13,14 However, for multilayers for which the applied Cu deposition potential is more positive than E EC Cu , the actual magnetic layer thickness will be smaller and the Cu layer thickness larger than the corresponding nominal values. The reason of this layer thickness deviation is the partial dissolution of Co atoms from the last magnetic layer during the Cu layer deposition pulse.…”
Section: Methodsmentioning
confidence: 99%
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