Microstructure, IMCs layer and reliability of Sn-58Bi solder joint reinforced by Mo nanoparticles during thermal cycling

Yang, Li; Zhu, Lu; Zhang, Yaocheng; Zhou, Shiyuan; Wang, Guoqiang; Shen, Sai; Shi, Xiaolong

doi:10.1016/j.matchar.2018.12.012

Cited by 62 publications

(13 citation statements)

References 55 publications

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“…This statement was also linked to the research by Shin et al, [72] explaining a similar reason with SiC nanoparticles additions in Sn58Bi solder alloy. Another study by Yang et al, [90] with additions of 0.25% Mo in the Sn58Bi shared similar findings. Meanwhile, the agglomerations of Mo nanoparticles observed in Figure 5 did not to affect the refinement of the microstructure (does not act as a nucleation site) since the weight percentage is low.…”

Section: Microstructure Of Sb and Sb + 3% Mo Nanoparticles Solder Alloysupporting

confidence: 60%

Effect Of 3% Molybdenum (Mo) Nanoparticles on The Melting, Microstructure and Hardness Properties of As- Reflowed Low Mass Sn-58Bi (SB) Solder Alloy

Singh

Durairaj

How

2020

ARFMTS

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The Sn-58Bi (SB) lead free solder alloy tested in this research with addition of 3% Molybdenum (Mo) nanoparticles equivalent to 0.6g mass to analyse the influences in the thermal, microstructure and microhardness. Elevation of 3.8°C was observed from the Differential Scanning Calorimetry (DSC) for the 3% Mo nanoparticles added SB solder alloy compared to the bare Sn-58Bi (SB) solder alloy that has a melting temperature of 142.25°C. The microstructures of the reinforced SB solder alloy were refined with closer lamellar structures of ?-Sn and Bi phases compared to the unreinforced SB solder. The SEM/EDX and X-ray Diffraction (XRD) results validate the presence of the 3% Mo nanoparticles in the SB solder. Mechanical properties by means of Vickers microhardness of the Mo reinforced solder alloy showed an increment in hardness value by 2% compared to the bare SB solder alloy. The presence of 3% Mo as discrete particles (dispersion strengthening) contributes to the increase on the hardness value. The introduction of 3% Mo in to the SB solder alloy resulted in increase in the hardness due to the refinement of the microstructure and at the same time allows low temperature soldering in the electronic packaging industry.

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Section: Microstructure Of Sb and Sb + 3% Mo Nanoparticles Solder Alloysupporting

confidence: 60%

Effect Of 3% Molybdenum (Mo) Nanoparticles on The Melting, Microstructure and Hardness Properties of As- Reflowed Low Mass Sn-58Bi (SB) Solder Alloy

Singh

Durairaj

How

2020

ARFMTS

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“…The severe skin effect for high frequency AC could be unignored and will typically arise in an incredibly high current density layer near the top, rendering it impossible to accurately predict the distribution of temperature in the test model (Yao and Basaran, 2012). In another work (Yang et al , 2019), it is discovered that the stressing of the AC current results in preferential atomic diffusion in the solder material that is compatible with the temperature distribution in the joint region. It was also observed that under stressing of the AC current, the lifespan of solder joints is significantly longer than the solders exposed to the direct current (DC) current.…”

Section: Introductionmentioning

confidence: 93%

An investigation on function of current type on solder joint degradation in electronic packages

Cai

Huang

Li³

et al. 2020

SSMT

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Purpose As in real applications several alternating current (AC) currents may be injected to the electronic devices, this study aims to analyze their effects on the lifetime of the solder joints and, consequently, shed the light on these effects at the design phase for other researchers to consider. Design/methodology/approach In this paper, the authors investigated on current waveform shapes on the performance and reliability of the solder joints in electronic package. Three common and extensively used current shapes in several simulations and experiments were selected to study their effects on the solder joint performance. Findings The results demonstrate a sever thermal swing and stress fluctuation in the solder joint induced in the case of triangle current type because the critical states lack any relaxation time. In fact, the stress intensification in the solder under application of the triangle current type has been shown to contribute to increasing brittle intermetallic compounds. An accelerated increase of on-state voltage of power semiconductor was also observed in under application of the triangle current type. Originality/value The originality of this paper is confirmed.

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“…Table 3 summarizes the shear stress of Sn-Bi solder with and without alloy element additions. Mokhtari and Nishikawa (2016); Yang et al (2019a); and Singh and Durairaj (2020) measured the shear strength of Sn-58Bi solder with different specimen thicknesses, thermal histories and strain rates. The increase in temperature above room temperature, resulted in a decrease in maximum shear stress where the highest shear stress recorded for Sn-58Bi solder was at room temperature.…”

Section: Shear Strengthmentioning

confidence: 99%

Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review

Kamaruzzaman

Goh

2022

SSMT

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Purpose This paper aims to review recent reports on mechanical properties of Sn-Bi and Sn-Bi-X solders (where X is an additional alloying element), in terms of the tensile properties, hardness and shear strength. Then, the effects of alloying in Sn-Bi solder are compared in terms of the discussed mechanical properties. The fracture morphologies of tensile shear tested solders are also reviewed to correlate the microstructural changes with mechanical properties of Sn-Bi-X solder alloys. Design/methodology/approach A brief introduction on Sn-Bi solder and reasons to enhance the mechanical properties of Sn-Bi solder. The latest reports on Sn-Bi and Sn-Bi-X solders are combined in the form of tables and figures for each section. The presented data are discussed by comparing the testing method, technical setup, specimen dimension and alloying element weight percentage, which affect the mechanical properties of Sn-Bi solder. Findings The addition of alloying elements could enhance the tensile properties, hardness and/or shear strength of Sn-Bi solder for low-temperature solder application. Different weight percentage alloying elements affect differently on Sn-Bi solder mechanical properties. Originality/value This paper provides a compilation of latest report on tensile properties, hardness, shear strength and deformation of Sn-Bi and Sn-Bi-X solders and the latest trends and in-depth understanding of the effect of alloying elements in Sn-Bi solder mechanical properties.

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Microstructure, IMCs layer and reliability of Sn-58Bi solder joint reinforced by Mo nanoparticles during thermal cycling

Cited by 62 publications

References 55 publications

Effect Of 3% Molybdenum (Mo) Nanoparticles on The Melting, Microstructure and Hardness Properties of As- Reflowed Low Mass Sn-58Bi (SB) Solder Alloy

Effect Of 3% Molybdenum (Mo) Nanoparticles on The Melting, Microstructure and Hardness Properties of As- Reflowed Low Mass Sn-58Bi (SB) Solder Alloy

An investigation on function of current type on solder joint degradation in electronic packages

Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review

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