Microstructure, isothermal and thermomechanical fatigue behaviour of leaded and lead-free solder joints

Ghaleeh, Mohammad; Baroutaji, Ahmad; Qubeissi, Mansour Al

doi:10.1016/j.engfailanal.2020.104846

Cited by 22 publications

(7 citation statements)

References 42 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In short, when the grain size is 5-15 μm, the filament has a longer life, higher reliability and better photoelectric performance than other filaments. 39,40 Optical performance of FC-LED filament after aging.-The blue flux of the three types of FC-LED filaments is shown in Fig. 19.…”

Section: Resultsmentioning

confidence: 99%

Effect of Solder Particle Size on the Mechanical and Thermal Reliability of Au/Sn Ag Cu/Cu Solder Joints

Zhai

Chen

et al. 2021

ECS J. Solid State Sci. Technol.

View full text Add to dashboard Cite

This paper investigates the effect of solders with different grain sizes (5–15 μm, 2–15 μm, 2–11 μm) on the mechanical and thermal reliability of flip-chip LED chip Au/Sn Ag Cu/Cu solder joints during reflow soldering. The lead-free solder SAC305 was selected as the solder. The microstructure of the IMC interface and the inferred surface of the solder joint is observed, and the microstructure evolution of the solder joint is analyzed. The void ratio of the solder joints under different grain sizes is tested to characterize the influence of the contact area between the chip and the solder joints on the shear stress. In addition, the solder joints were aged for 1000 h under a relative humidity of 85 °C/85%. The photoelectric thermal performance of the FC-LED filament and the influence of high temperature and high humidity aging on the reliability of the filament were tested and analyzed. The results show that when the size of the solder paste is small and the uniformity is poor within a certain range of solder size, the voids in the flux layer are large and concentrated, and the void ratio is significantly higher, which leads to a decrease in the mechanical reliability of the solder joints. The thermal resistance test results show that the cavity will cause excessive thermal resistance, poor heat dissipation, a significant increase in junction temperature, and a decrease in thermal reliability, which in turn leads to severe light aging and ultimately changes in photoelectric performance. When the grain size is 5–15 μm, the uniformity of the particle size is good. After the filament is aged for 1000 h at high temperature and humidity, the light maintenance rate remains at 65.6%, and the filament performance is stable and reliable. It has certain reference value in the actual production process.

show abstract

Section: Resultsmentioning

confidence: 99%

Effect of Solder Particle Size on the Mechanical and Thermal Reliability of Au/Sn Ag Cu/Cu Solder Joints

Zhai

Chen

et al. 2021

ECS J. Solid State Sci. Technol.

View full text Add to dashboard Cite

show abstract

“…e fatigue life of the gearbox shell structure is calculated using the S-N curve model of the gearbox shell material of the highspeed train and the random vibration analysis results of the gearbox shell structure, combined with the three-interval method [27,28] and the linear cumulative damage rule [29,30]. As listed in Table 6, based on the S-N curve model of gearbox shell material (9) the number of permitted cycles of the gearbox shell structure under 3sigma equivalent stress is calculated.…”

Section: Life Prediction Of Gearbox Shell Based On Three-interval Met...mentioning

confidence: 99%

The Cross-Scale Life Prediction for the High-Speed Train Gearbox Shell Based on the Three-Interval Method

et al. 2022

Scientific Programming

View full text Add to dashboard Cite

The gearbox shell is a key component of class A of high-speed trains. In engineering applications, the fatigue life prediction of the gearbox shell is a critical issue to be addressed. It is not feasible to obtain fatigue life results for the gearbox shell experimentally because of its long design life, lack of actual failure data, complex structure, high test cost, and material dispersion. Therefore, the cross-scale method was introduced to accurately predict the fatigue life of the gearbox shell. In this study, the entire gearbox shell is divided into two scales of “material structure.” Firstly, the S-N curve is plotted within the material layer, based on the data from the rotating bending fatigue test. Secondly, the finite element model of the gearbox shell is established within the structural layer via the simulation platform. The characteristics and random vibration of the established model are analyzed and presented. Additionally, the first ten-order frequency of modal analysis and power spectral density responses of the gearbox are obtained. The fatigue life of the gearbox shell and the safe running distance of the train are calculated by using the three-interval method and the linear cumulative damage rule, respectively, by combining the fatigue analysis from the material layer with the simulation analysis from the structure layer. Finally, to illustrate the application of the proposed method, a group of small-scale test examples is provided. The proposed method can be used in fatigue life prediction more effectively than the single finite element simulation method.

show abstract

“…Based on a profile-based reliability assessment, Jabarullah et al [15] unveiled that the solder joint failure was initiated with the IMC growth and followed by the appearance of voids in the microstructure. Another study demonstrated that the microstructural coarsening was the main mechanism prevailing the isothermal fatigue evolution in the solder joints [16]. Libot et al [17] showed that the thermal cycling intensified mis-oriented grain boundaries in the microstructure of SAC305 solder, leading to inter-granular crack initiation at high strain zones.…”

Section: Introductionmentioning

confidence: 99%

Expectation–maximization machine learning model for micromechanical evaluation of thermally-cycled solder joints in a semiconductor

Chen

2023

J. Phys.: Condens. Matter

View full text Add to dashboard Cite

This paper aims to study the microstructural and micromechanical variations of solder joints in a semiconductor under the evolution of thermal-cycling loading. For this purpose, a model was developed on the basis of expectation-maximization machine learning (ML) and nanoindentation mapping. Using this model, it is possible to predict and interpret the microstructural features of solder joints through the micromechanical variations (i.e. elastic modulus) of interconnection. According to the results, the classification of Sn-based matrix, intermetallic compounds and the grain boundaries with specified elastic-modulus ranges was successfully performed through the ML model. However, it was detected some overestimations in regression process when the interfacial regions got thickened in the microstructure. The ML outcomes also revealed that the thermal-cycling evolution was accompanied with stiffening and growth of intermetallic compounds; while the spatial portion of Sn-based matrix decreased in the microstructure. It was also figured out that the stiffness gradient becomes intensified in the treated samples, which is consistent with this fact that the thermal cycling increases the mechanical mismatch between the matrix and the intermetallic compounds.

show abstract

Microstructure, isothermal and thermomechanical fatigue behaviour of leaded and lead-free solder joints

Cited by 22 publications

References 42 publications

Effect of Solder Particle Size on the Mechanical and Thermal Reliability of Au/Sn Ag Cu/Cu Solder Joints

Effect of Solder Particle Size on the Mechanical and Thermal Reliability of Au/Sn Ag Cu/Cu Solder Joints

The Cross-Scale Life Prediction for the High-Speed Train Gearbox Shell Based on the Three-Interval Method

Expectation–maximization machine learning model for micromechanical evaluation of thermally-cycled solder joints in a semiconductor

Contact Info

Product

Resources

About