Microstructure, mechanical properties, and drop reliability of CeO<sub>2</sub> reinforced Sn–9Zn composite for low temperature soldering

Sharma, Ashutosh; Srivastava, Ashok; Ahn, Byungmin

doi:10.1088/2053-1591/ab0225

Cited by 14 publications

(15 citation statements)

References 41 publications

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“…Secondly, it is an environmentally benign and safe technique as compared to chemical routes (solution precipitation, plating, chemical vapor deposition) where toxic waste disposal and drainage costs are added up [17][18][19]. In addition, high-energy ball milling is a simple and effective way to produce novel nanostructured materials, homogeneous chemical distribution, and extension of solid solubility and widens the scope of HEA [34][35][36][37][38][39][40]. Further densification of milled powders by heat treatment, hotpressing, cold isostatic pressing, or spark plasma sintering (SPS) technique gives the stable bulk HEA.…”

Section: Fillers Processed By Powder Technologymentioning

confidence: 99%

High-Entropy Alloys for Micro- and Nanojoining Applications

Sharma¹

2020

Engineering Steels and High Entropy-Alloys

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The aim of this chapter is to provide a basic understanding of the metal-ceramic joints and high-entropy alloy (HEA) research in microjoining applications. We will first overview the issues in metal-ceramic brazing and solutions to overcome those issues using various fillers. Various approaches are available for joining ceramic to metallic materials. One approach will be to look for brazing alloys with the so-called high-entropy characteristics which exhibit a solid solution phase. The conventional alloy design and arc melting, Bridgman solidification, and advanced powder metallurgy techniques will be studied, including high-energy ball milling (HEBM) for the mechanical alloying process, and hot-press and spark plasma sintering (SPS) techniques are utilized for improved densification and phase transformation. We also summarize the various thermodynamic relations to obtain the high-entropy phase and present future possibilities of high-entropy alloys in microjoining research at the later stage of this chapter.

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Section: Fillers Processed By Powder Technologymentioning

confidence: 99%

High-Entropy Alloys for Micro- and Nanojoining Applications

Sharma¹

2020

Engineering Steels and High Entropy-Alloys

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“…The spreadability of the filler metal onto the substrate can be determined by the spread area difference of the melt before and after the heating. The spreadability is defined from the following relation [21][22][23][24][25][26][27][28][29]:…”

Section: Problems In Wetting Of Ceramics Substrate By Liquid Metalmentioning

confidence: 99%

Recent Advances in Active Metal Brazing of Ceramics and Process

et al. 2019

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Ceramic to metal joining has its potential applications in microelectronics packaging, metal-ceramic seals, vacuum tubes, sapphire metal windows, etc. But there are many limitations in joining this duo of materials that range from their structures, nature of bonding, physical properties to a complex phenomenon like wetting, spreading and adhesion. The current review discusses these critical issues from the aspects of thermodynamics, the role, and type of active elements, Ag-Cu-Ti brazing filler system and the reliability factors like residual stress, coefficient of thermal expansion, material reliability, pores and unbonded regions on the surface which affect the mechanical reliability of the joint.

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“…e difference between the onset melting point (solidus) and peak melting (liquidus), the so-called pasty range, is very narrow (<10°C). A narrow pasty range has been reported to benefit the joining process as it avoids the defects like porosity and/or hot tear that occurs during thermal fluctuations [20,21]. In other words, the change in the melting point of Ag-Cu-Ti-xCeO 2 composites is not high enough to bring any change in service temperature conditions.…”

Section: Brazeabilitymentioning

confidence: 99%

“…More recently, Shin and his coworkers have improved the wetting and brazing property of Al 2 O 3 /Cu joints with the addition of Sn in the Ag-Cu-Ti alloy during the brazing process [3]. Halbig [14,15,[19][20][21][22][23]. However, in ceramic brazing, limited studies exist on nanocomposite-based brazing fillers [24][25][26].…”

Section: Introductionmentioning

confidence: 99%

Brazeability, Microstructure, and Joint Characteristics of ZrO₂/Ti-6Al-4V Brazed by Ag-Cu-Ti Filler Reinforced with Cerium Oxide Nanoparticles

Sharma

Ahn

2019

Advances in Materials Science and Engineering

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In this work, we have attempted to develop the Ag-Cu-Ti filler for bonding ZrO 2 to Ti-6Al-4V. e CeO 2 nanoparticles were reinforced in the eutectic Ag-Cu-Ti filler via mechanical mixing and melting route. Furthermore, the brazeability, microstructure, and mechanical behavior, as well as brazing performance of the ZrO 2 /Ti-6Al-4V joints, were assessed. e wettability of the Ag-Cu-Ti matrix was increased from 89 to 98% on Ti-6Al-4V and from 83 to 89% on the ZrO 2 substrate after the addition of 0.05% CeO 2 . Also, there was a depression in the melting point of the composite fillers up to 3°C. e microstructure consists of Cu-and Ag-rich phases and Cu-Ti intermetallic compounds (IMCs). e joint shear strength was improved with the addition of CeO 2 up to 0.05 wt.% in the matrix. It was inferred that, for an excellent brazing performance of the ZrO 2 /Ti-6Al-4V joint, the optimum amount of CeO 2 should be 0.05 wt.% in the Ag-Cu-Ti matrix.

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Microstructure, mechanical properties, and drop reliability of CeO₂ reinforced Sn–9Zn composite for low temperature soldering

Cited by 14 publications

References 41 publications

High-Entropy Alloys for Micro- and Nanojoining Applications

High-Entropy Alloys for Micro- and Nanojoining Applications

Recent Advances in Active Metal Brazing of Ceramics and Process

Brazeability, Microstructure, and Joint Characteristics of ZrO₂/Ti-6Al-4V Brazed by Ag-Cu-Ti Filler Reinforced with Cerium Oxide Nanoparticles

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Microstructure, mechanical properties, and drop reliability of CeO2 reinforced Sn–9Zn composite for low temperature soldering

Cited by 14 publications

References 41 publications

High-Entropy Alloys for Micro- and Nanojoining Applications

High-Entropy Alloys for Micro- and Nanojoining Applications

Recent Advances in Active Metal Brazing of Ceramics and Process

Brazeability, Microstructure, and Joint Characteristics of ZrO2/Ti-6Al-4V Brazed by Ag-Cu-Ti Filler Reinforced with Cerium Oxide Nanoparticles

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Product

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About

Microstructure, mechanical properties, and drop reliability of CeO₂ reinforced Sn–9Zn composite for low temperature soldering

Brazeability, Microstructure, and Joint Characteristics of ZrO₂/Ti-6Al-4V Brazed by Ag-Cu-Ti Filler Reinforced with Cerium Oxide Nanoparticles