Microstructure, nanoindentation, and electrochemical properties of the nanocrystalline nickel film electrodeposited from choline chloride–ethylene glycol

Gu, C.D.; You, Yong Sung; Yu, Yating; Qu, Shaoxing; Tu, Jiangping

doi:10.1016/j.surfcoat.2011.04.098

Cited by 69 publications

(50 citation statements)

References 40 publications

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“…The m value for NC Cu is consistent with that for the same brush-plated NC Cu obtained in tensile tests[15], the m values for NC Ni-20Fe and NC Ni are similar to those for the electrodeposited NC Ni-20Fe alloy obtained in tensile tests[27] and the electrodeposited NC Ni obtained in nanoindentation tests[37,38]. The larger m value of NC Cu as compared with NC Ni-20Fe and NC Ni arises from two possible reasons: one is the enhanced GB H ) curves of NC Cu, NC Ni-20Fe and NC Ni obtained in the holding regime.…”

supporting

confidence: 80%

Effects of loading strain rate and stacking fault energy on nanoindentation creep behaviors of nanocrystalline Cu, Ni-20 wt.%Fe and Ni

Sun

Zhang

et al. 2015

Journal of Alloys and Compounds

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supporting

confidence: 80%

Effects of loading strain rate and stacking fault energy on nanoindentation creep behaviors of nanocrystalline Cu, Ni-20 wt.%Fe and Ni

Sun

Zhang

et al. 2015

Journal of Alloys and Compounds

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“…We had demonstrated that Ni coatings were electrodeposited from Ethaline by dissolving NiCl 2 · 6H 2 O. 29,30 In this case, NaH 2 PO 2 · H 2 O was added into the Ni plating bath as the phosphorus source to deposit Ni-P alloy coatings. The Ni plating bath contained 0.30 M NiCl 2 · 6H 2 O in the eutectic solvent.…”

mentioning

confidence: 99%

Electrochemical Synthesis and Characterization of Ni–P Alloy Coatings from Eutectic–Based Ionic Liquid

You

Wang

et al. 2012

J. Electrochem. Soc.

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Ni-P alloy coatings with tunable phosphorus contents are electrodeposited at room temperature using choline chloride:ethylene glycol (1:2 molar ratio) deep eutectic solvent and NiCl 2 · 6H 2 O, NaH 2 PO 2 · H 2 O as nickel and respectively phosphorous sources. Cyclic voltammetry shows that the presentence of H 2 PO 2 − in the ionic liquid based Ni plating bath promotes the initiation of Ni-P nucleation. Chronoamperometric results indicate that the electrodeposition of Ni and Ni-P alloys on a platinum electrode follows the mechanism of instantaneous nucleation and three-dimensional growth with diffusion-controlled. Surface morphology and chemical composition of the alloy coatings are significantly dependent on the molar ratio of H 2 PO 2 − /Ni 2+ in the electrolyte. Moreover, deposition potential and time have a remarkable effect on the surface morphology of deposits. X-ray diffractometer analysis indicates that the structure of alloys converts from crystalline to amorphous structure as the phosphorus content in the coating increases. Potentiodynamic polarization measurements show that the alloy coating exhibits the nobler corrosion potential and the lower corrosion current density compared with the Ni coating. The more phosphorus content the Ni-P coating has, the more positive corrosion potential and the lower corrosion current density the coating exhibits.Ni-P alloy coatings are of great commercial interest, which can be prepared either by electrodeposition or electroless deposition from aqueous solutions containing metal salts and a phosphorous compound. 1-6 Both routes lead to the P co-deposition and it is well known that its presence in the alloy contributes for the enhancement of corrosion resistance, 5,7-10 hardness, 11-13 wear resistance, 14 and electrocatalytic activity. [15][16][17][18][19][20][21][22] Due to its excellent properties, interest of the scientific community in Ni-P alloys is aroused, which has resulted in a large number of investigations on various aspects of the fascinating coatings. Traditional Ni-P electroplating is based on aqueous solutions which have high solubility for electrolytes and metal salts resulting in highly conducting solutions. However, the alkaline or acid based Ni-P plating solutions that are most generally employed seem to be corrosive and suffer from drawbacks including toxic effluent and air pollution. Ionic liquids (ILs) are more advantageous media for electrodeposition of metals and semiconductors due to their wide electrochemical windows, low vapor pressures, and cation/anion effects. 23-25 Importantly, most of ILs are less corrosive and considered as suitable alternatives for many poisonous plating baths. 26 To the best of our knowledge, there is still no investigation to electrochemical synthesis of the traditional Ni-P alloys from ILs based electrolytes. Therefore, there is a critical need for examining the possibility of electrodeposition of Ni-P alloys from ILs and to know the underlying deposition mechanism. Clearly, this kind of work would be more promising....

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“…%, the value of approximately 2 kA/m was slightly higher than that for the aqueous plating bath. 19 The improvement in the soft magnetic properties is one of our future works.…”

Section: Resultsmentioning

confidence: 98%

Magnetic Fe-Co films electroplated in a deep-eutectic-solvent-based plating bath

Yanai

Shiraishi

Watanabe

et al. 2015

Journal of Applied Physics

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We fabricated Fe-Co films from a deep eutectic solvent (DES)-based plating bath and investigated magnetic properties of the plated films. The plating baths were obtained by stirring the mixture of choline chloride, ethylene glycol, FeCl 2 Á4H 2 O, and CoCl 2 Á6H 2 O. The composition of the plated films depended on the amount of FeCl 2 Á4H 2 O in the plating bath, and Fe content of the films was varied from 0 to 100 at. %. Depending on the Fe content, the saturation magnetization and the coercivity of the films varied. The Fe 76 Co 24 film shows high saturation magnetization and smooth surface, and the change in the saturation magnetization shows good agreement with the expected change by the Slater-Pauling curve. High current efficiency (>90%) could be obtained in the wide film composition. From these results, we concluded that the DES-based plating bath is one of effective baths for the Fe-Co films with high current efficiency. V C 2015 AIP Publishing LLC.

show abstract

Microstructure, nanoindentation, and electrochemical properties of the nanocrystalline nickel film electrodeposited from choline chloride–ethylene glycol

Cited by 69 publications

References 40 publications

Effects of loading strain rate and stacking fault energy on nanoindentation creep behaviors of nanocrystalline Cu, Ni-20 wt.%Fe and Ni

Effects of loading strain rate and stacking fault energy on nanoindentation creep behaviors of nanocrystalline Cu, Ni-20 wt.%Fe and Ni

Electrochemical Synthesis and Characterization of Ni–P Alloy Coatings from Eutectic–Based Ionic Liquid

Magnetic Fe-Co films electroplated in a deep-eutectic-solvent-based plating bath

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