2004
DOI: 10.1016/j.surfcoat.2003.10.089
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Microstructure of the near-surface layers of austenitic stainless steels irradiated with a low-energy, high-current electron beam

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Cited by 48 publications
(26 citation statements)
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“…The main reason of cratering is a local overheating and melting of second-phase particles [5,6,27]. In turn, the formation of residual tensile stresses is associated with the high thermal gradients in the surface layers during the cooling [5,6].…”
Section: Titanium Alloysmentioning
confidence: 99%
“…The main reason of cratering is a local overheating and melting of second-phase particles [5,6,27]. In turn, the formation of residual tensile stresses is associated with the high thermal gradients in the surface layers during the cooling [5,6].…”
Section: Titanium Alloysmentioning
confidence: 99%
“…The HCPEB treatments were conducted under the following conditions: the electron energy 25 keV, the pulse duration 1 μs, the spray distance 80 mm, and the vacuum 5×10 −3 Pa. More details about the HCPEB system can be found in Refs. 22,23 .…”
Section: Methodsmentioning
confidence: 99%
“…Before irradiation, the surface of a Сu film has a roughness R a = 0.25-0.35 µm, which corresponds to the roughness of the surface of a substrate multiply irradiated beforehand with an LEHCEB [14]. After single irradiation with E s = 2.8-8.4 J/cm 2 , R a remains almost unchanged, testifying that the topography of the substrate surface before coating deposition plays the dominant part.…”
Section: Topography Of the Surfacementioning
confidence: 95%
“…The local exfoliation of the film and its nonuniform mixing with the substrate on irradiation is related to the formation of microcraters at the filmsubstrate interface. It has been shown [14] that multiple pulsed melting of type 316 stainless steels substantially reduces the probability of cratering due to the removal of undesirable impurities from the surface. In this connection, in all further experiments the substrates were irradiated with an LEHCEB with E s = 8-10 J/cm 2 , N = 30 before deposition of a copper film.…”
Section: Topography Of the Surfacementioning
confidence: 99%