Microstructure of thermal hillocks on blanket Al thin films

Kim, Deok‐kee; Heiland, Birgit; Nix, William D.; Arzt, Eduard; Deal, Michael D.; Plummer, J.D.

doi:10.1016/s0040-6090(00)00971-8

Cited by 82 publications

(39 citation statements)

References 8 publications

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“…Such a behavior is frequently encountered for stressed aluminum and lead films, most of the time-but not always-at elevated temperature. [33][34][35] It is obviously caused by the compressive stress reached in the film upon unloading of the pressure, which induces the material to flow out of plane. Thicker films of about 300 nm thickness show extrusions forming inside very large grains [Figs.…”

Section: Microscopic Observationsmentioning

confidence: 99%

Bulge fatigue testing of freestanding and supported gold films

Merle

Göken

2014

J. Mater. Res.

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The bulge test was used to investigate the fatigue properties of gold thin films with a thickness between 100 and 300 nm. The membranes were pressurized at a rate of 0.2 Hz up to 10 5 times, during which their stress and strain states were continuously recorded. Gold films on a silicon nitride substrate were cyclically loaded into tension and compression. Due to the presence of the substrate, no membrane failure was observed, but the residual stress shifted from an initially tensile state to an increasingly compressive one. Typical fatigue damage mechanisms consisting of extrusions were found in some large grains. Freestanding films were cyclically loaded in pure tension until failure occurred. The data acquired during the fatigue tests show a strong ratcheting of the films, which is indicative of cyclic plastic creep. Microstructural investigations clearly show grain boundary sliding in very thin films with columnar grains extending through the thickness.

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Section: Microscopic Observationsmentioning

confidence: 99%

Bulge fatigue testing of freestanding and supported gold films

Merle

Göken

2014

J. Mater. Res.

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“…As mechanical stresses increase with decreasing geometrical or structural dimensions, the probability of stress-induced failure increases, which in turn can lead to the failure of microelectronic devices such as, for example, manifested in the formation of voids and hillocks on conductor lines in semiconductor devices [3] or passivation cracking due to a pile-up of dislocations at passivation layer interfaces [4].…”

Section: Introductionmentioning

confidence: 99%

Synchrotron X-ray microdiffraction reveals rotational plastic deformation mechanisms in polycrystalline thin films

Nyilas

Kobas²,

Spolenak

2009

Acta Materialia

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“…It is well established that external compressive stresses (pressure up to 7,500 psi) can enhance tin whisker growth rate by factors as high as 10,000. [23][24][25] This observation indicates that compression stress induced by the mounting screw enhanced whisker formation. The other area is located in the corner of the sample.…”

Section: Whisker Development In CD 17 Ca 3 Single Crystalsmentioning

confidence: 85%

Migration, Formation, and Growth of Pure Cd Whiskers in Cd-Based Compounds

Lograsso

Anderegg

2007

Journal of Elec Materi

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The migration, formation, and growth of Cd islands and long whiskers were studied in single crystals of Cd 84 Yb 16 , Cd 51 Yb 14 , and Cd 17 Ca 3 and polycrystals of Cd 85 Ni 15 and high-purity Cd. It was found that Cd moves rapidly to the sample surface in quasi-crystal Cd 84 Yb 16 , forming islands in less than 2 h. The Cd whiskers that have submicron diameters and lengths of several hundred microns to millimeters can grow in several days under high vacuum. Evidence was presented to demonstrate that the whiskers grow from the base instead of the tip. While whiskers are easily observed in hex-CdYb, i-CdYb, and CdCa single crystals, no Cd whisker formation or migration of any kind was present on the surfaces of Cd 85 Ni 15 and pure Cd samples, subjected to similar environmental conditions for even longer durations. This result suggests that oxidation of the reactive element is essential for the enhanced whisker growth kinetics observed. Because Cd islands and whiskers grow spontaneously in a matter of hours instead of months required for tin or zinc whiskers, CdYb alloys would be good candidates for detailed whisker formation and growth mechanisms studies.

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Microstructure of thermal hillocks on blanket Al thin films

Cited by 82 publications

References 8 publications

Bulge fatigue testing of freestanding and supported gold films

Bulge fatigue testing of freestanding and supported gold films

Synchrotron X-ray microdiffraction reveals rotational plastic deformation mechanisms in polycrystalline thin films

Migration, Formation, and Growth of Pure Cd Whiskers in Cd-Based Compounds

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