Microstructures and mechanical properties of Al 2519 matrix composites reinforced with Ti-coated SiC particles

Dong, Cuige; Cui, Rui; Wang, Richu; Peng, Chaoqun; Cai, Zhiyong

doi:10.1016/s1003-6326(20)65260-8

Cited by 17 publications

(4 citation statements)

References 29 publications

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“…At present, metals such as Ni-P [ 90 ], MgO [ 54 ], Cu [ 91 ], Cr [ 92 ] and Ti [ 93 , 94 ] are all deposited on the surface of SiCp as coatings to prevent contact between SiCp and molten Al and inhibit the occurrence of adverse interface reactions. Li et al [ 95 ] the electroless plating method is adopted to Cu plating on the surface of SiCp, by means of pressureless infiltration technique was used to prepare the SiCp/Al composite materials, has not found the existence of Al 4 C 3 , explains the Cu coating can effectively inhibit really interface reaction, but it does not represent no interface reaction.…”

Section: Current Status Of Metal-based Electronic Packaging Materialsmentioning

confidence: 99%

Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends

Lai

Niu

et al. 2023

Micromachines

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With the advancement of semiconductor technology, chip cooling has become a major obstacle to enhancing the capabilities of power electronic systems. Traditional electronic packaging materials are no longer able to meet the heat dissipation requirements of high-performance chips. High thermal conductivity (TC), low coefficient of thermal expansion (CTE), good mechanical properties, and a rich foundation in microfabrication techniques are the fundamental requirements for the next generation of electronic packaging materials. Currently, metal matrix composites (MMCs) composed of high TC matrix metals and reinforcing phase materials have become the mainstream direction for the development and application of high-performance packaging materials. Silicon carbide (SiC) is the optimal choice for the reinforcing phase due to its high TC, low CTE, and high hardness. This paper reviews the research status of SiC-reinforced aluminum (Al) and copper (Cu) electronic packaging materials, along with the factors influencing their thermo-mechanical properties and improvement measures. Finally, the current research status and limitations of conventional manufacturing methods for SiC-reinforced MMCs are summarized, and an outlook on the future development trends of electronic packaging materials is provided.

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Section: Current Status Of Metal-based Electronic Packaging Materialsmentioning

confidence: 99%

Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends

Lai

Niu

et al. 2023

Micromachines

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“…The shells of the core-shell particles synthesized in the composite materials are all TiC, and there are two reasons for the formation of a TiC shell: (i) It is reported that the atomic diffusion rate is related to the radius, and the diffusion rate of Al is faster than that of Ti. When the carbon source reacts with the mixed melt of Al-Ti, the Al-C reaction tends to be inside the carbon source, while the Ti-C reaction occurs on the surface of the carbon source [31]. (ii) Because TiC is more thermodynamically stable, Al 4 C 3 will further react with Ti by reaction (3) to form TiC.…”

Section: The Synthesis Processes Of Tic In Al Melts Used Different Ca...mentioning

confidence: 99%

The Influence of Carbon Sources on the Microstructures of In Situ-Synthesized TiC in Al Melts

Ding

Jia

et al. 2022

Materials

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In this work, graphite and diamond are successfully introduced into Al melts and TiC is in situ-synthesized based on reactive wetting. It is found that the microstructures of the prepared TiC-reinforced Al composites are varied with the change in carbon sources and their sizes. TiC particles tend to form agglomerations in the composites prepared by both graphite and diamond, but the size of the TiC particles as well as their agglomerations will decrease with the decrease in the carbon source size. In addition, the Ti-C reaction is also difficult to fully carry out due to the influence of the Al-C reaction. As a result, in addition to TiC particles, Al4C3 will also be present in the composites prepared by graphite, especially when the size of graphite is large. As for the composites prepared by diamond, diamond@Al4C3@TiC core–shell particles will form when the size of the diamond is large, such as 10 μm in this work, and these particles will transform into Al4C3@TiC core–shell particles when the size of the diamond is decreased.

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“…The SiC particles in SiCp/Al composite are difficult to be wetted with the brazing filler, and the wettability of brazing filler can be improved by electroless nickel plating. Nickel-plated composites have an improved relative density and matrix strength [5][6][7]. The brazing filler can also wet composite materials and produce compact and strong welded joints [8][9][10][11].…”

Section: Introductionmentioning

confidence: 99%

Effects of plating thickness on SiCp /Al composite brazed joint structure and performance

Fan,

YANG,

GAO

et al. 2023

Preprint

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To clarify the effects of plating thickness on the structure and performance of the brazed joints of a SiCp/Al composite, the surface of the SiCp/6063Al composite was treated with electroless nickel plating. The microstructure, shear strength, air-tightness, and fracture morphology of the nickel-plated SiCp/6063Al composite brazed joints were analyzed by SEM and other experimental methods. The results demonstrated that the structure and morphology of the brazing seams of the SiCp/6063Al composite with different plating thicknesses were basically the same. Specifically, the structure of the brazing seam was mostly dense, without holes or gaps. The shear strength of brazed joints increased with the nickel plating thickness. The brazing of nickel-plated SiCp/6063Al composite with a plating time of 30 min, brazing temperature of 290 ℃, and holding time of 30 min led to brazed joints with a high shear strength and good air-tightness. According to the analysis of the shear fracture morphology and the EDS spectrum the feature region of the brazed joint, fractures of the brazed joint mainly occurred in the brazing filler layer and at the junction of the brazing filler and nickel plating.

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Microstructures and mechanical properties of Al 2519 matrix composites reinforced with Ti-coated SiC particles

Cited by 17 publications

References 29 publications

Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends

Advancements in SiC-Reinforced Metal Matrix Composites for High-Performance Electronic Packaging: A Review of Thermo-Mechanical Properties and Future Trends

The Influence of Carbon Sources on the Microstructures of In Situ-Synthesized TiC in Al Melts

Effects of plating thickness on SiCp /Al composite brazed joint structure and performance

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