Microstructures and Properties of the Copper‐Coated SiC_p Reinforced Al–Si Alloy Composites

Abstract

Copper-coated silicon carbide (SiC) particles have been developed to improve the strength and wear resistance of Al-Si matrix composites, which are utilized in brake pads and, hence find applications in aerospace and automobile industries. Copper-coated SiC powder is prepared by electroless plating and is characterized by scanning electron microscopy and X-ray diffraction. Copper-coated SiCp reinforced Al-Si composites are prepared by a powder metallurgy method, and their microstructures and properties are compared with those of Al-Si and Al-Si-Cu matrix composites reinforced with SiCp without copper coating. Our results show that the copper-coated SiC p -reinforced Al-Si composite exhibits advantageous mechanical properties and better frictional wear resistance.

Preparation of Ni‐Encapsulated ZTA Particles as Precursors to Reinforce Iron‐Based Composites

“…Metal‐encapsulated ceramic particles are commonly fabricated by ball milling, electroless deposition, sol‐gel, and precipitation deposition . Specifically, electroless deposition has been recognized as one of the most useful methods for preparing metal‐encapsulated ceramics . Electroless deposition is an autocatalytic chemical reaction in aqueous solution that can produce the surface metallization of conductive and nonconductive substrates.…”

Effect of Reinforcement Size on Mechanical Behavior of SiC-Nanowires-Reinforced 6061Al Composites

“…Zhang et al [ 46 ] found that the surface modification of β-Si 3 N 4 whiskers can improve the relative density of β-Si 3 N 4 w/Al composites. Feng et al [ 47 ] electroless plated Cu on the surface of SiCp, which could greatly improve the wettability of SiCp and Al-Si alloys, and then the density of the composites was greatly improved. These results can be used to further improve the densification results of the material.…”

Copper Plating on SiCp by Cooling Crystallization and Its Effects on the Spreading and Infiltration of AlSi12 Alloy Melt

“…It can be seen from formula (5), for the wetting angle of SiCp and AlSi12 alloy melt, when θ < 90°, ΔP > 0, ΔP promotes the passage of AlSi12 melt. When θ > 90°, ΔP < 0, ΔP hinders the passage of AlSi12 melt.…”

“…SiCp/Al composites are widely used in aerospace, automotive, electronic packaging, and other fields [1][2][3][4][5] due to their high strength, high modulus, and excellent wear resistance. [6][7][8][9] The application demand of SiCp/Al composites with thickness more than 200 mm is increasing.…”