2012
DOI: 10.1016/j.matlet.2012.08.075
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Microwave assisted low temperature encapsulation of Ag films by Cu reactions using Ag–Cu alloy structures

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Cited by 5 publications
(3 citation statements)
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“…Previously, we have reported low temperature encapsulation of Ag films by copper oxides on Si using MW annealing technique. 6 Over the years, these electromagnetic waves have gained more and more importance recently in low temperature and quicker processing of materials with improved properties compared to conventional annealing techniques. Because of the photocatalytic properties of Ag/CuO nanocomposites reported by Wang et al, 7 we also anticipate the use of Agdoped CuO thin film coating on flexible solar panels with photocatalytic properties to decompose complex dirt particles.…”
Section: Introductionmentioning
confidence: 99%
“…Previously, we have reported low temperature encapsulation of Ag films by copper oxides on Si using MW annealing technique. 6 Over the years, these electromagnetic waves have gained more and more importance recently in low temperature and quicker processing of materials with improved properties compared to conventional annealing techniques. Because of the photocatalytic properties of Ag/CuO nanocomposites reported by Wang et al, 7 we also anticipate the use of Agdoped CuO thin film coating on flexible solar panels with photocatalytic properties to decompose complex dirt particles.…”
Section: Introductionmentioning
confidence: 99%
“…The synthesis of CuAg was achieved using different techniques such as laser cladding [13], blasting [1], microwaves [14], ball milling [15], chemical vapour deposition [16], pulsed laser deposition [17], wet chemical method [18], ion beam mixing [19], and electrodeposition (ED) [7,20]. The ED technique has many potential advantages over the other techniques mentioned above, including the ability to deposit nanocrystalline coatings at a low cost, the ability to produce compact pore-free dense coatings, crystal particle size, microstructure, and roughness [21][22][23].…”
Section: Introductionmentioning
confidence: 99%
“…However, the surface treatment of copper particles is not only complicated but also possible to lose the electrical characteristics and the thermal stabilities of the Cu@Ag particles [12, 13]. In general, increasing the Ag content of Cu@Ag nanoparticle can reduce the impact of surface treatment of copper particles, but it costs lots of silver [14, 15]. Thus, the development of a simple and low‐cost method for fabricating Cu@Ag core–shell nanoparticles is significant.…”
Section: Introductionmentioning
confidence: 99%