2014
DOI: 10.1007/s10854-014-2522-x
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Microwave dielectric properties of low-fired Li2ZnTi3O8–TiO2 composite ceramics with Li2WO4 addition

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Cited by 5 publications
(3 citation statements)
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“…However, most high Q × f dielectric materials are manufactured at high sintering temperatures, which hinder their incorporation with low melting-point electrodes and polymer-based substrates and lead to excess energy consumption and evaporation of volatile components. For practical application, LTCC requires excellent microwave dielectric properties, low sintering temperature, and adequate co-fire matching between ceramics and electrodes [5][6][7][8][9][10]. Materials with low melting points are often added to LTCC to reduce the required firing temperatures.…”
Section: Introduction mentioning
confidence: 99%
“…However, most high Q × f dielectric materials are manufactured at high sintering temperatures, which hinder their incorporation with low melting-point electrodes and polymer-based substrates and lead to excess energy consumption and evaporation of volatile components. For practical application, LTCC requires excellent microwave dielectric properties, low sintering temperature, and adequate co-fire matching between ceramics and electrodes [5][6][7][8][9][10]. Materials with low melting points are often added to LTCC to reduce the required firing temperatures.…”
Section: Introduction mentioning
confidence: 99%
“…High sintering temperatures not only hinder their incorporation with low melting electrode and polymer based substrates but also lead to huge energy consumption and volatile components evaporation. For practical application, LTCC requires not only excellent microwave dielectric properties but also low sintering temperature and good co-fire matching between ceramics and electrodes [5][6][7][8][9][10]. Materials with low melting point are often added in order to lower the firing temperatures.…”
Section: Introductionmentioning
confidence: 99%
“…Modern electronic devices tend to be miniature and portable, thus it requires the related electronic components to be highly integrative and with high performance. To meet the requirement of the miniaturization of microwave components for wireless communication, low-temperature co-fired ceramic (LTCC) technology becomes an important method [3][4][5][6][7][8]. The dielectric material used in LTCC must have a variety of dielectric constant materials to permit future integration and embedded passive components.…”
Section: Introductionmentioning
confidence: 99%