2022
DOI: 10.1109/mmm.2022.3173478
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Microwave/Millimeter-Wave Packaging for 5G and Beyond: Materials, Technologies, and Techniques [From the Guest Editors’ Desk]

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“…The first inter-Society (with the EPS) focused issue of IEEE Microwave Magazine[1] was published in August 2022. Dr. Samanta was the guest editor from TC-16.…”
mentioning
confidence: 99%
“…The first inter-Society (with the EPS) focused issue of IEEE Microwave Magazine[1] was published in August 2022. Dr. Samanta was the guest editor from TC-16.…”
mentioning
confidence: 99%