2004 14th International Crimean Conference "Microwave and Telecommunication Technology" (IEEE Cat. No.04EX843) 2004
DOI: 10.1109/crmico.2004.183080
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Microwave solid-state power amplifiers - state-of-the-art and future trends

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“…A better versatility and lower fabrication costs are obtainable by reducing the size of the systems. All these three features are mainly affected by the last module of the transmitter, i.e., the RF power module [2], [3]. The latter, in fact, absorbs the major of the supplied energy, it is the main responsible of nonlinearities, which limit the exploitation of the spectrum, and it requires a large chip area for delivering high RF power.…”
Section: Introductionmentioning
confidence: 99%
“…A better versatility and lower fabrication costs are obtainable by reducing the size of the systems. All these three features are mainly affected by the last module of the transmitter, i.e., the RF power module [2], [3]. The latter, in fact, absorbs the major of the supplied energy, it is the main responsible of nonlinearities, which limit the exploitation of the spectrum, and it requires a large chip area for delivering high RF power.…”
Section: Introductionmentioning
confidence: 99%
“…In backhaul, instead, center frequencies and bandwidths are higher [7], while the power levels are limited to 10–15 W in the lower bands, and further reduce at higher frequencies. The backhaul market is currently dominated by GaAs monolithic microwave integrated circuits (MMIC) combined class-AB PA (AB-PA), while it is still an open question if the adoption of more costly technologies, like GaN [8, 9], and/or more complex architectures, like the DPA, are justified by the expected efficiency increase [10, 11]. As a matter of fact, the clear advantages theoretically given by these solutions are reduced by the need of more complex (and possibly more energy eager) linearization schemes.…”
Section: Introductionmentioning
confidence: 99%
“…Although Ku band high power amplifiers have already been developed with GaAs based FETs (Zhong et al, 2006;Darbandi et al, 2002;Ishimaru et al, 1999), remarkable improvements in size and weight of amplifiers are considered to be possible with GaN based high electron mobility transistors (HEMTs). For example, the package size of amplifier can be reduced due to their high power density (Boles et al, 2010;Kistchinsky, 2009), and the size and weight of cooling unit can be also reduced, as GaN epitaxial layers can be grown on SiC substrate, which is a better thermal conductor than GaAs. These are great advantages especially for satellite communication systems, due to stability at high temperature.…”
Section: Introductionmentioning
confidence: 99%