PurposeMicrowave curing (MC) can facilitate rapid concrete repair in cold climates without using conventional accelerated curing technologies which are environmentally unsustainable. Accelerated curing of concrete under MC can contribute to the decarbonisation of the environment and provide economies in construction in several ways such as reducing construction time, energy efficiency, lower cement content, lower carbonation risk and reducing emissions from equipment.Design/methodology/approachThe paper investigates moisture loss and pore properties of six cement-based proprietary concrete repair materials subjected to MC. The impact of MC on these properties is critically important for its successful implementation in practice and current literature lacks this information. Specimens were microwave cured for 40–45 min to surface temperatures between 39.9 and 44.1 °C. The fast-setting repair material was microwave cured for 15 min to 40.7 °C. MC causes a higher water loss which shows the importance of preventing drying during MC and the following 24 h.FindingsPortland cement-based normal density repair mortars, including materials incorporating pfa and polymer latex, benefit from the thermal effect of MC on hydration, resulting in up to 24% reduction in porosity relative to normal curing. Low density and flowing repair materials suffer an increase in porosity up to 16% due to MC. The moisture loss at the end of MC and after 24h is related to the mix water content and porosity, respectively.Originality/valueThe research on the application of MC for rapid repair of concrete is original. The research was funded by the European commission following a very rigorous and competitive review process which ensured its originality. Original data on the parameters of porosity and moisture loss under MC are provided for different generic cementitious repair materials which have not been studied before. Application of MC to concrete construction especially in cold climates will provide environmental, economic and energy benefits.