Millimeter-Wave Phased-Array Antenna-in-Package (AiP) Using Stamped Metal Process for Enhanced Heat Dissipation

Park, Junho; Choi, Dooseok; Hong, Wonbin

doi:10.1109/lawp.2019.2938229

Cited by 34 publications

(22 citation statements)

References 9 publications

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“…The surface mount antennas can be easily integrated into the same package with the RF chipsets, as shown in [7] and [8]. Compared with [7] and [8], the proposed antenna was fabricated on a low-cost FR4 substrate by using the standard printed circuit board (PCB) techniques. The cost-effective feature is more attractive than metal antennas.…”

Section: Measurement Results and Discussionmentioning

confidence: 99%

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Surface-Mount Pifa Using Ball Grid Array Packaging for 5g Mmwave

Wang¹,

Liu²,

Zhang³

et al. 2021

PIER Letters

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In this letter, a surface-mount planar inverted-F antenna (PIFA) is proposed for the 5G mmWave system using ball grid array packaging (BGA). To meet the requirement of cost-effectiveness, the proposed antenna element is designed on a single FR4 layer to achieve low cost. To achieve a compact size, the BGA packaging is used on the proposed antenna element. Finally, the size of the antenna prototype is only 4.5 mm × 4.5 mm × 1.3 mm. Besides, the surface-mount feature allows the proposed antenna to be integrated with other devices in the same system package. The simulation and measurement results are discussed in detail. The measurement results show that the impedance bandwidth of −10 dB is 15.3% (24.7-29.6 GHz), and the peak gain is 5.85 dBi at 28 GHz. The proposed PIFA can be used in the 5G NR bands N257 (26.5-29.5 GHz), .

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Section: Measurement Results and Discussionmentioning

confidence: 99%

“…Most importantly, the interconnection using the surface-mount technique avoids the use of bulky and lossy connections. For example, surface-mount technology was applied to the stamped metal antenna [7] and wideband 3D patch antenna [8].…”

Section: Introductionmentioning

confidence: 99%

Surface-Mount Pifa Using Ball Grid Array Packaging for 5g Mmwave

Wang¹,

Liu²,

Zhang³

et al. 2021

PIER Letters

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“…Most of the studies where thermal management aspects are somehow addressed tend to present only results of the RF measurements integrated with suitable commercially available heat spreaders. An interesting investigation on thermal management aspects of phased-array antennas is reported in [53]- [56], even though the focus of these studies is not on BFIC design. In [54], [55], the benefits associated with sparse antenna array architectures are evaluated, and it is shown that thick ground planes can passively cool phased-array antenna systems in a rather effective way.…”

Section: Current State Of the Artmentioning

confidence: 99%

“…In [54], [55], the benefits associated with sparse antenna array architectures are evaluated, and it is shown that thick ground planes can passively cool phased-array antenna systems in a rather effective way. In [56], the authors present a metal stamped antenna-in-package (AiP) design that serves as a passive cooler. The proposed design approach, however, is limited to uniform linear array architectures only.…”

Section: Current State Of the Artmentioning

confidence: 99%

A Design Framework for Beamforming Integrated Circuits Operating at Mm-Wave Frequencies

Theis¹,

Song²,

Federico³

et al. 2021

IEEE Access

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In order to cope with the needs of fifth-generation (5G) cellular networks and beyond, phasedarray antenna systems operating at millimeter-wave (mm-wave) frequencies will be required. This makes the system design very complex. In order to create insight and agility in the design process, we propose a framework that visualises the requirements and trade-offs of 5G-and-beyond systems. Our literature survey uses this framework to compare state-of-the-art papers on Silicon-based beamforming integrated circuits (BFICs) operating in the mm-wave band. Three use-cases are analyzed: Base-stations (BSs), Gateways (GtWs) and User Terminals (UTs). Based on the framework, we explore which implementation fits best with each use-cases. In UT, space and power consumption are the main constraints. For BSs, the main constraint is in output power and noise figure (NF). Finally, in GtW applications there is more flexibility as it has a larger footprint than UT but doesn't necessarily need to cover the same link-budget constraints of BSs. One of the identified limitations throughout all the cases is the heat generation, which is seen as a major bottleneck in mm-wave phased arrays. Only a few of the references show proper modelling and simulations for heat transfer of the realized BFICs. Finally, a limitation in the BFICs is the output power. In order to realize a mm-wave link at least 13 dBm would be required at the input of each antenna element. Only few references meet this criterion, and only at saturation. Further, in order to achieve more than 13 dBm in back-off operation a higher power density would be required. This would imply a further increase of heat generation in the system.

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“…Many materials can be applied to AiP technology. For example, metal-based [17,18], organic laminates [10,[19][20][21], low-temperature cofired ceramic [22][23][24][25], glass-based substrate [26], and silicon-based substrate [27]. The mentioned antennas can be integrated with active chips into the same package.…”

Section: Introductionmentioning

confidence: 99%