Milling characteristics of extruded eutectoid Zn–Al alloy

Hirata, Víctor Manuel López; Muñoz, Marta; Hernández, José Carlos Rodríguez; Zhu, Yao

doi:10.1016/s0921-5093(98)00480-8

Cited by 14 publications

(2 citation statements)

References 5 publications

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“…were correspondingly involved in the investigation. [60][61][62] 3.2.1 Effects of external stress on decomposition of the 0 s phase The cast ingot of the eutectoid Zn-Al based alloy (ZnAl22Cu2) was extruded at 250 C for homogenization and then machined into standard tensile specimens of 6 mm diameter with 20 mm gage length. The specimens were solution-treated at 350 C for 4 days, then quenched into ice water.…”

Section: Effects Of External Stress On Phase Transformationmentioning

confidence: 99%

General Rule of Phase Decomposition in Zn-Al Based Alloys (II)

Zhu

2004

Mater. Trans.

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Microstructural changes and phase transformation of Zn-Al based alloys (ZA alloys) were systematically investigated during various thermal and thermo-mechanical processes using X-ray diffraction (XRD), scanning electron microscopy (SEM), electron probe micro-analysis (EMPA), transmission electron microscopy (TEM), electron back-scattered diffraction (EBSD) and differential scanning calorimeter (DSC) etc. techniques. Phase decompositions of the alloys were studied under various thermal and thermo-mechanical circumstances. General rule of phase decomposition (II) (On effects of external stresses on phase transformation) was summarized with explanations from point view of Gibbs free energy.

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Section: Effects Of External Stress On Phase Transformationmentioning

confidence: 99%

General Rule of Phase Decomposition in Zn-Al Based Alloys (II)

Zhu

2004

Mater. Trans.

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“…It is also a convenient method to produce commercial solder pastes by adding flux directly to MA powders. 35,[44][45][46] Wetting is an essential prerequisite for soldering to ensure good bonding between solders and substrates. Therefore, the contact angle of as-prepared solder pastes on metallized substrates was measured and compared with the commercial pastes.…”

Section: Introductionmentioning

confidence: 99%

Lead-free Sn-Ag and Sn-Ag-Bi solder powders prepared by mechanical alloying

Lai

Duh

2003

Journal of Elec Materi

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A mechanical alloying (MA) process was used to produce lead-free solder pastes of Sn-3.5Ag and the Sn-3.5Ag-4Bi system. Because of the high energy induced by repeated fracturing and welding, the grinding media played an important role during the MA process. A ceramic container was used to provide stronger impact force, which could induce phase transformation better than a Teflon container. In addition, it was found that 1-cm balls could fracture Bi particles and promote their dissolution into the Sn matrix. On the contrary, the milling process tended to achieve homogeneous mixing when using 3-mm balls. The MA powders, after milling with 3-mm balls, showed a small endothermic peak from the differential scanning calorimetry (DSC) profile at around 138°C, which was the eutectic temperature of Sn-Bi. The melting points of the MA powders in the ceramic container were measured to be 221°C and 203°C, respectively, for Sn-3.5Ag and Sn-3.5Ag-4Bi from the DSC curves. The reduced melting point ensured the complete melting during reflow with a peak temperature of 240°C. The formation of Ag 3 Sn was also observed from the x-ray diffraction peaks, indicating successful alloying by MA. The solder pastes could, thus, be produced by adding flux into the MA powders. The wetting property of the solder joint was also evaluated. The as-prepared solder pastes on electroless Ni-P/Cu/Si showed good metallurgical bonding with a contact angle less than 20°.

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