Miniaturised Sensor Node for Tire Pressure Monitoring (e-CUBES)

Schjølberg-Henriksen, Kari; Taklo, Maaike M. Visser; Lietaer, Nicolas; Prainsack, Josef; Dielacher, Markus; Klein, M.; Wolf, J.K.; Weber, Josef; Ramm, Peter; Seppänen, Timo

doi:10.1007/978-3-642-00745-3_21

Cited by 9 publications

(8 citation statements)

References 19 publications

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“…The efficiency Ș for the 3×10 μm 2 TSV is depicted in the solid line, where the losses at the operating frequency of 2.1 GHz can already be found by more than 70 %. In (18) the impact of three different parameters on the RF performance is investigated: the thickness of the isolation oxide, the conductance of the substrate, and the thickness of the substrate.…”

Section: Discussionmentioning

confidence: 99%

“…The pressure sensor is a glasssilicon-glass triple-stack with a total thickness of about 1 mm and a footprint of 1.8×2.1 mm 2 . The electrical signal from the sensor was routed through silicon pins insulated by the glass of the cap wafer (2). The microcontroller (μC), with a footprint of 4.0×3.6 mm 2 , includes RAM, ROM and the sensor interface.…”

Section: The Wireless Sensor Nodementioning

confidence: 99%

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Miniaturization of a Wireless Sensor Node by Means of 3D Interconnects

et al. 2010

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This work presents an advanced sensor node for direct tire pressure monitoring with an overall size below 1 cm3, where the applied components are arranged in a 3D integrated stack for high compactness, improved thermal behavior, and enhanced robustness for pressure, inertia, and temperature sensing. The utilized through silicon via (TSV) technology is introduced and the wide range of resulting issues for the design of a sensor node are considered. In particular, the radio frequency (RF) characteristics of TSVs are investigated in detail focusing on their electrical efficiency. Finally an optimized TSV design is presented, which allows the connection of a Bulk Acoustic Wave (BAW) resonator with an impedance of 2 kΩ at 2.1 GHz. Thus, all required types of interconnections within the sensor node can be realized by means of the TSV technology.

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Section: Discussionmentioning

confidence: 99%

Section: The Wireless Sensor Nodementioning

confidence: 99%

Miniaturization of a Wireless Sensor Node by Means of 3D Interconnects

et al. 2010

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“…The components depicted with the dark gray shaded area are arranged in a 3D integrated stack silicon-glass triple-stack with a total thickness of about 1 mm and a footprint of 1.8 9 2.1 mm 2 . The electrical signals from the sensor are routed through silicon pins insulated by the glass of the cap wafer (Schjølberg-Henriksen et al 2009). The microcontroller (lC), with a footprint of 4.0 9 3.6 mm 2 , includes RAM, ROM and the sensor interface.…”

Section: D Integrationmentioning

confidence: 99%

Design issues of BAW employment in 3D integrated sensor nodes

et al. 2009

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In the field of wireless sensor node design a wide range of new potentials are opened by means of emerging 3D integration technologies. These technologies enable the design of highly integrated sensor nodes, but the designers face novel challenges, which specialized communications engineers are not familiar with. This work presents an advanced direct tire pressure monitoring system (TPMS) with an overall size below 1 cm3 applying through silicon vias (TSV) and points out two selected design issues arising due to this high level of integration. At first design issues caused by temperature gradients within the 3D integrated chip stack are presented. Multi physics simulations show that a systematical temperature measurement error is introduced by self heating, which would affect the communication performance if unconsidered. Furthermore the radio frequency (RF) characteristics of TSVs, focusing on their electrical efficiency, are investigated. In particular the behavior of TSVs for connecting a bulk acoustic wave resonator with an impedance of 2 kX at 2.1 GHz is evaluated in detail

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“…Here, MEMS and IC devices are integrated with a broad spectrum of other basic technologies, ranging from optics and power electronics to wireless components, in a common package 2 . As shown in Figure 5, complete sensor nodes comprising chip-level MEMS, ASIC, wireless communication and power management components are 3D integrated at the package level 62,63 . In summary, the key advantages of multi-chip solutions are their modularity, high flexibility and reasonably low fabrication complexity.…”

Section: Hybrid Integration Of Mems and Ics: Multi-chip Solutionsmentioning

confidence: 99%

Integrating MEMS and ICs

et al. 2015

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The majority of microelectromechanical system (MEMS) devices must be combined with integrated circuits (ICs) for operation in larger electronic systems. While MEMS transducers sense or control physical, optical or chemical quantities, ICs typically provide functionalities related to the signals of these transducers, such as analog-to-digital conversion, amplification, filtering and information processing as well as communication between the MEMS transducer and the outside world. Thus, the vast majority of commercial MEMS products, such as accelerometers, gyroscopes and micro-mirror arrays, are integrated and packaged together with ICs. There are a variety of possible methods of integrating and packaging MEMS and IC components, and the technology of choice strongly depends on the device, the field of application and the commercial requirements. In this review paper, traditional as well as innovative and emerging approaches to MEMS and IC integration are reviewed. These include approaches based on the hybrid integration of multiple chips (multi-chip solutions) as well as system-on-chip solutions based on wafer-level monolithic integration and heterogeneous integration techniques. These are important technological building blocks for the 'More-ThanMoore' paradigm described in the International Technology Roadmap for Semiconductors. In this paper, the various approaches are categorized in a coherent manner, their merits are discussed, and suitable application areas and implementations are critically investigated. The implications of the different MEMS and IC integration approaches for packaging, testing and final system costs are reviewed.

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Miniaturised Sensor Node for Tire Pressure Monitoring (e-CUBES)

Cited by 9 publications

References 19 publications

Miniaturization of a Wireless Sensor Node by Means of 3D Interconnects

Miniaturization of a Wireless Sensor Node by Means of 3D Interconnects

Design issues of BAW employment in 3D integrated sensor nodes

Integrating MEMS and ICs

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