2000 IEEE Ultrasonics Symposium. Proceedings. An International Symposium (Cat. No.00CH37121)
DOI: 10.1109/ultsym.2000.922581
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Miniaturization and advanced functionalities of SAW devices

Abstract: Apart from the active semiconductor chips a multitude of surface acoustic wave filters (SAW filters) are the key components that make modem RF circuits for mobile telecommunication and multimedia applications work. The latter are the most sophisticated and delicate species of passive components of which today's RF applications contain several hundred. While active integration has led to decreasing numbers of semiconductors inside a phone, at the time being the passive components outnumber the actives by far. O… Show more

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Cited by 15 publications
(2 citation statements)
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“…But it's difficult to make the smaller size package because they need space for chip SMT (Surface Mount Technology) and encapsulation. [1][2][3][4][5][6] WLP (Wafer Level Package) is prospected on the smaller size, lower height, less weight and higher performance for the SAW filter. To realize the WLP SAW filter, wafer level technology has to be studied on wafer bonding, wafer thinning and via drilling.…”
Section: Introductionmentioning
confidence: 99%
“…But it's difficult to make the smaller size package because they need space for chip SMT (Surface Mount Technology) and encapsulation. [1][2][3][4][5][6] WLP (Wafer Level Package) is prospected on the smaller size, lower height, less weight and higher performance for the SAW filter. To realize the WLP SAW filter, wafer level technology has to be studied on wafer bonding, wafer thinning and via drilling.…”
Section: Introductionmentioning
confidence: 99%
“…Center frequencies have shifted from 1 GHz to above 2 GHz. At the same time, further functionality has been added to the pure filtering function [1]. Two examples of such additional functions are impedance transformation or balun functionality.…”
mentioning
confidence: 99%