Miniaturized Flexible Interdigital Sensor for &lt;italic&gt;In Situ&lt;/italic&gt; Dielectric Cure Monitoring of Composite Materials

2014 IEEE/ASME International Conference on Advanced Intelligent Mechatronics

2014

For producing Carbon Fiber Reinforced Plastics (CFRP) with desired mechanical and physical properties, it is essential to monitor the polymerization process. Therefore, sensors will be embedded in the composite in order to monitor temperature, pressure and/or curing index online. Inlays are foreign-objects in CFRP and behave as a wound in the composite. The composite may resist to foreign-objects. The impact of embedding sensors (inlays) on homogeneity and structural integrity of CFRP is not known yet. The aim of this study is to investigate the influence of embedding inlay on the mechanical properties of CFRP. Inlays of different materials from thick and rigid (silicon with different thicknesses) to soft and flexible (Polyimide and SU8) were embedded in the CFRP composite. These inlays are considered as embedded sensors for online monitoring. The impact of the inlay's different sizes, types and patterns (existence of cavities) on composite were investigated by performing inter-laminar shear strength tests. The results of the inter-laminar shear strength tests clarified that not only can the flexibility of embedded sensors reduce the foreign-object effect of that in the composite, but also altering the size and substrate's patterning can play an important role in improving the properties of composite with the embedded sensors.

Section: Introductionmentioning

confidence: 99%

Embedding rigid and flexible inlays in carbon fiber reinforced plastics

Moghaddam

Boll

2014 IEEE/ASME International Conference on Advanced Intelligent Mechatronics

2014

“…Thus, in-situ monitoring of the resin cure is necessary. Interdigital capacitive sensors are the most common sensors for in-situ cure monitoring of resins [1][2][3][4][5]. They are available in a microscale dimensions with a perforated substrate [4] for minimizing the so-called wound effect [6].…”

Section: Introductionmentioning

confidence: 99%

Screen-Printed Interdigital Structure on Flexible RTM6 Substrate

Moghaddam

Hübner

Proceedings of Eurosensors 2017, Paris, France, 3–6 September 2017

2017

Self Cite

Ideally, for non-invasive sensor integration in fiber reinforced composites, sensors should be made of resin or fibers. For the first time, the curing degree of RTM6 resin in Glass Fiber Reinforced Polymer (GFRP) is measured with a sensor made of the identical resin that reinforces the fibers. Resin Transfer Molding type RTM6 is mixed with a plasticizer to get a thin and flexible substrate. Interdigital Capacitive (IDC) sensor is screen-printed using silver filled epoxy on the flexible RTM6 substrate. The sensor is integrated into GFRP and the curing of the RTM6 resin in glass fiber reinforced polymer composite is measured successfully.

“…Sensor structures are fabricated on thin foils on wafer level. One example is an interdigital structure on 5 µm thick polyimide foil to monitor the curing of carbon fiber reinforced plastics [6]. The characteristic size of such systems is less than 10 µm.…”

Section: Introductionmentioning

confidence: 99%

Printed Sensors for Material Integrated Sensing: Functionalization of Semi-Finished Parts

Dumstorff

Proceedings of Eurosensors 2017, Paris, France, 3–6 September 2017

2017

Self Cite

Abstract:A new and innovative approach is presented to integrate sensors in materials and set up "smart materials". Semi-finished parts are functionalized by printed sensors and printed interconnects. These functionalized parts are then further processed to components. This is a new and simple approach to integrate sensors in a material. Two examples of printed sensors and the process of integration are presented. One is a printed sensor on carbon weaves, integrated in carbon fiber reinforced plastic. The other one is a sensor structure printed on an aluminum sheet and integrated during high pressure die casting. Besides the benefits of this technological approach, challenges are focused in the paper as well.