MIRAGE: developments in IRSP systems, RIIC design, emitter fabrication, and performance

Abstract

SBIR's family of MIRAGE infrared scene projection systems is undergoing significant growth and expansion. The first two lots of production IR emitters have completed fabrication at Microelectronics Center of North Carolina/Research and Development Institute (MCNC-RDI), and the next round(s) of emitter production has begun. These latest emitter arrays support programs such as Large Format Resistive Array (LFRA), Optimized Array for Space-based Infrared Simulation (OASIS), MIRAGE 1.5, and MIRAGE II. We present the latest performance data on emitters fabricated at MCNC-RDI, plus integrated system performance on recently completed IRSP systems. Teamed with FLIR Systems/Indigo Operations, SBIR and the Tri-Services IRSP Working Group have completed development of the CMOS Read-In Integrated Circuit (RIIC) portion of the Wide Format Resistive Array (WFRA) program -to extend LFRA performance to a 768 x 1536 "wide screen" projection configuration. WFRA RIIC architecture and performance is presented. Finally, we summarize development of the LFRA Digital Emitter Engine (DEE) and OASIS cryogenic package assemblies, the next-generation Command & Control Electronics (C&CE).

The research of non-uniformity correction technologies for resistor array dynamic infrared scene projector

“…On the other hand, each micro-emitter unit cell in an array will have a slightly different input/output response relationship due to the inherent variability of the micro-fabrication processes. There are several factors in the resistor array fabrication runs, such as manufacturing inhomogeneities, etch non-uniformity, alternate reflector, connection between the pixel resistors and the electric drive nodes, semi-automatic wire bonding, the dead pixel occurrence and packaging process, are able to affect the uniformity of the resistor array device 23,24 . Especially for the advanced large format resistive array (1024×1024 or 1024×2048), the quality of micro-fabrication is a crucial factor of the uniformity.…”

“…For a resistor array device with certain design and micro-fabrication technique, the non-uniformity induced by operation process of the projector, which is including but not limited to thermal/optical crosstalk, random noise, temporal drift in bias or gain response, the changing of surroundings temperature, and scene-dependent effects, should be considered as another significant factor which can affect the quality of the infrared scene [23][24][25][26][27][28] . After a long runtime, the changing of read-in drive signal, nonlinearity of the resistor array response and the non-uniformity of background voltage will change the uniformity of the device.…”

A micro-mirror modulator for infrared simulation modeling stands

“…Как представлено в работе [7], модулятор 8060-6439B (в дальнейшем будем использовать торговые обозначения модуляторов) был применен в ге-нераторе ИК изображений без какой-либо модификации. Это стало возмож-ным ввиду характера входных окон модуляторов.…”

“…Ключевыми элементами этих стендов являются генераторы инфра-красных изображений, обеспечивающие формирование как тестовых изобра-жений, так и реальных динамических сцен [3]. В настоящее время наиболее распространенными в стендах динамической генерации ИК сцен являются тепловые источники излучения [4][5][6][7][8], которые пригодны для генерации сцен, моделирующих тела с равномерной излучающей способностью. Однако при моделировании излучающего тела необходимо задавать как яркость излуче-ния поверхностей, так и его спектральный состав [9,10].…”

Midinfrared LEDs versus thermal emitters in IR dynamic scene simulation devices

“…In this letter, we examine whether conventional LEDs can form a platform for photonic MWIR DISP devices able to compete with advanced thermal microemitter technology 15,16 in testing and stimulating IR sensors, including forward-looking IR missile warning systems, IR search-and-track devices, and missile seekers. We also consider how they relate to the laser-based DISP technology which also worth to be mention even if not commercially realized yet.…”