Mixed-sputter deposition of Ni-Ti-Cu shape memory films

Formation of B19′ martensite in annealed Ti44.6Ni40.1Cu15.3 thin films and their shape recovery characteristic

“…The phase transformation in Ti-Ni-Cu shape-memory-alloys has been extensively studied by many researchers [5][6][7][8][9][10][11]. Whereas the addition of Cu slightly changes the transformation temperature, it changes the transformation path and drastically reduces the temperature hysteresis [12].…”

An Investigation on Phase Formations and Microstructures of Ni-rich Ni-Ti Shape Memory Alloy Thin Films

“…[10][11][12][13] Additional works were developed that employed sputtering from elemental targets (Ni and Ti) by adjusting the individual target power. [14][15][16] This method of sputtering was remarkably flexible and simple to control the composition of the Ni-Ti thin film. The transformation and shape memory characteristics of Ni-Ti thin films were shown to depend strongly on alloy composition, [17,18] annealing temperature, [19,20] aging temperature and time, [17,21] Ar pressure, sputtering power, substrate temperature, etc.…”

High-throughput study of martensitic transformations in the complete Ti–Ni–Cu system

“…However, only a few investigations of "off-stoichiometric" compositions are available, and are restricted to single compositions [25e27] and linear compositional variations: e.g. Ti 50Àx/2 Ni 50Àx/2 Cu x (x 10 at.%) [28,29], Ti x Ni 92Àx Cu 8 (x ¼ 49e51 at.%) [30,31], Ti x Ni 93Àx Cu 7 (x ¼ 47e51 at.%) [32], Ti 40 Ni 60Àx Cu x (x ¼ 1, 2, 3, 3.5, 5, 10, 30 at.%) [33] or limited portions of the ternary system [34,35].…”