Untitled

Experimental and modeling analysis of the formation of cuprous intermediate species formed during the copper deposition on a rotating disk electrode

“…Comprehensive models for the electrodeposition of copper in acidic sulfate media have reported that Cu 2+ ions in solution are reduced in two consecutive 1-electron transfer steps [1][2][3][4][5][6][7][8][9][10][11][12]. This reaction pathway involves the formation of intermediate cuprous species.…”

“…In the literature, a clear distinction has been made to describe the phase of this intermediate formed in the first reduction step. Some studies [1][2][3][4][5][6] report that the cuprous species is adsorbed (Cu(I) ads ) on the substrate, whereas other authors [7][8][9][10][11][12] suggest that it is a soluble species (Cu + ) located on the solution side and close to the surface of the electrode.…”

“…The generation of very small amounts of Cu + in solution by deposition has been reported in deoxygenated solutions at low cathodic overpotentials on the basis of rotating-disc electrode studies [7][8][9][10][11][12], even when ligands (i.e. chlorides) to stabilize Cu + ions are not used in solution [17].…”

“…chlorides) to stabilize Cu + ions are not used in solution [17]. Danilov et al [11,12] studied the copper electrocrystallization in different acidic sulfate media with a Pt/GC ring-disk electrode. Cyclic voltammetry (CV) experiments showed that negative scans close to the equilibrium potential produced the accumulation of Cu + ions, followed by the deposition of these ions, respectively:…”

Influence of organic additives on the initial stages of copper electrodeposition on polycrystalline platinum

“…This last technique offers many advantages: it is the least expensive, it has the highest deposition rate, the lowest toxicity and is readily adoptable [1][2][3]. The main electrolytes used for copper electrodeposition are acidic and contain copper sulfate as a metal source [1,[4][5][6][7][8], but apparently electrical properties as well as resistance to corrosion have to be warranted. This can be achieved by small amounts of organic additives, such as DPS [9], PEG [9][10][11][12], SPS [10,11], IT-85 [13,14],thiourea [13,[15][16][17][18][19][20][21][22][23][24], to the copper electrolytes.…”