2012 International Conference on Indium Phosphide and Related Materials 2012
DOI: 10.1109/iciprm.2012.6403364
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MOCVD based zinc diffusion process for planar InP/InGaAs avalanche photodiode fabrication

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“…Chamber and furnace diffusion methods have been proposed to drive p-type dopant into InP/InGaAs heterostructure by selective-area diffusion. For example, the metalorganic vapor phase deposition (MOCVD) with dimethylzinc (DMZ) or diethylzinc (DEZ) source [14][15][16][17][18][19] is a chamber diffusion method, which can diffuse a 4 inch wafer, but its cost is high. The furnace diffusion has some disadvantages, such as the lack of lateral uniformity, poor reproducibility, and restriction of wafer size.…”
Section: Introductionmentioning
confidence: 99%
“…Chamber and furnace diffusion methods have been proposed to drive p-type dopant into InP/InGaAs heterostructure by selective-area diffusion. For example, the metalorganic vapor phase deposition (MOCVD) with dimethylzinc (DMZ) or diethylzinc (DEZ) source [14][15][16][17][18][19] is a chamber diffusion method, which can diffuse a 4 inch wafer, but its cost is high. The furnace diffusion has some disadvantages, such as the lack of lateral uniformity, poor reproducibility, and restriction of wafer size.…”
Section: Introductionmentioning
confidence: 99%