Modeling and Analysis of Carbon-Nanotube Interconnections for Future Nanotechnology Interconnections between High Speed CMOS Integrated Circuits using FDTD Method
Abstract:The size reduction of copper interconnects degrades their performances due to increased surface scattering, which significantly reduces the effective electron mean free path. Unlike Cu, CNTs support ballistic electron flow with a lower value of mean free, which highly induces researchers to change copper by carbon nanotubes. In this way, this paper presents an accurate method based on the finite difference method describing the behavior of carbon nanotube interconnects in the time domain. The proposed algorith… Show more
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