Modeling and Analysis of Radiated Emissions and Signal Integrity of Capacitively Loaded Printed Circuit Board Interconnections

Wong, Bert; Cantoni, A.

doi:10.1109/temc.2012.2187298

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Modeling and Analysis of Radiated Emissions and Signal Integrity of Capacitively Loaded Printed Circuit Board Interconnections

Cited by 6 publications

References 24 publications

MoM validation of the predicted radiated emissions of two signal integrity damping schemes on PCB microstrips

MoM validation of the predicted radiated emissions of two signal integrity damping schemes on PCB microstrips

On the Response of Multiconductor Superconducting Microstrip Lines Under Plane Wave Excitation

Analytical Solution for Maximum Differential-Mode Radiated Emissions of Microstrip Trace

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