Modeling and Analysis of Simultaneous Switching Noise Coupling for a CMOS Negative-Feedback Operational Amplifier in System-in-Package

Shim, Yujeong; Park, Jong-Bae; Kim, Jaemin; Song, Eakhwan; Yoo, Jeongsik; Pak, Junso; Kim, Joungho

doi:10.1109/temc.2009.2026637

Cited by 19 publications

(5 citation statements)

References 17 publications

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“…is type of noise degrades the circuit performance and makes system sensitivity dominated. It can directly be transmitted to an active circuit via the substrate; therefore, the signal and power are corrupted, the system reliability is reduced, and the bit error rate is increased [21,22]. A TSV is composed of a conductor surrounded by an insulation layer with a very small thickness, which causes an important capacitance between the TSV and the substrate; as a consequence, at high frequencies, a noise can be easily coupled from one TSV to another or substrate and vice versa.…”

Section: Tsv-tsv and Tsv-active Circuit Noise Couplingmentioning

confidence: 99%

Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling

Belaid

Belahrach

Ayad

2021

Applied Computational Intelligence and Soft Computing

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In this paper, two intelligent methods which are GAs and PSO are used to model noise coupling in a Three-Dimensional Integrated Circuit (3D-IC) based on TSVs. These techniques are rarely used in this type of structure. They allow computing all the elements of the noise model, which helps to estimate the noise transfer function in the frequency and time domain in 3D complicated systems. Noise models include TSVs, active circuits, and substrate, which make them difficult to model and to estimate. Indeed, the proposed approaches based on GA and PSO are robust and powerful. To validate the method, comparisons among the results found by GA, PSO, measurements, and the 3D-TLM method, which presents an analytical technique, are made. According to the obtained simulation and experimental results, it is found that the proposed methods are valid, efficient, precise, and robust.

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Section: Tsv-tsv and Tsv-active Circuit Noise Couplingmentioning

confidence: 99%

Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling

Belaid

Belahrach

Ayad

2021

Applied Computational Intelligence and Soft Computing

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“…, z ±k = exp ±j 2πkT τ , and C k = exp(ckT) τ , while τ = NT, ∀k, and z N ±k = exp(± j2πk) = 1. In Equation 12, the first and the third sum are evaluated using the FFT and IFFT algorithms, respectively, while other parts, which present the infinite sum, are used as the input data in the q-d algorithm that uses a very small number of necessary additional terms, as explained in [24]. The computing region should be chosen as:…”

Section: Calculation Of Time-domain Tsv Noise Coupling In 3d-ic Desigmentioning

confidence: 99%

“…This noise degrades system performance and makes it more sensitive. It can also be transmitted directly to an active circuit through the substrate; therefore, the signal and power are corrupted, the system reliability is reduced, and the bit error rate is increased [24,25].…”

Section: Introductionmentioning

confidence: 99%

Numerical Laplace Inversion Method for Through-Silicon Via (TSV) Noise Coupling in 3D-IC Design

2019

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Typical 3D integrated circuit structures based on through-silicon vias (TSVs) are complicated to study and analyze. Therefore, it seems important to find some methods to investigate them. In this paper, a method is proposed to model and compute the time-domain coupling noise in 3D Integrated Circuit (3D-IC) based on TSVs. It is based on the numerical inversion Laplace transform (NILT) method and the chain matrices. The method is validated using some experimental results and the Pspice and Matlab tools. The results confirm the effectiveness of the proposed technique and the noise is analyzed in several cases. It is found that TSV noise coupling is affected by different factors such as source characteristics, horizontal interconnections, and the type of Inputs and Outputs (I/O) drivers.

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“…Power/ground noise, such as simultaneous switching noise (SSN), is a major concern in high-speed circuit designs for achieving high performance and high reliability of electronic systems. As the number of transistors and power consumption of a very large-scale integration (VLSI) increases significantly, power/ground noise severely affects the overall system performance [1][2][3][4]. The power/ground noise produces the problem of glitches, timing push-out of digital signals, and power-supply voltage fluctuations.…”

Section: Introductionmentioning

confidence: 99%

Meander-DGS Effect on Electromagnetic Bandgap Structure for Power/Ground Noise Suppression in High-Speed Integrated Circuit Packages and PCBs

Kim

2022

Electronics

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In this paper, we present the impact of a meander-shaped defected ground structure (MDGS) on the slow-wave characteristics of a lowest-order passband and a low cutoff frequency of the first stopband of an electromagnetic bandgap (EBG) structure for power/ground noise suppression in high-speed integrated circuit packages and printed circuit boards (PCBs). A semi-analytical method is presented to rigorously analyze the MDGS effect. In the analytical method, a closed-form expression for a low cutoff frequency of the MDGS-EBG structure is extracted with an effective characteristic impedance and a slow-wave factor. The proposed analytical method enables the fast analysis of the MDGS-EBG structure so that it can be easily optimized. The analysis of the MDGS effect revealed that the low cutoff frequency increases up to approximately 19% while comparing weakly and strongly coupled MDGSs. It showed that the miniaturization of the MDGS-EBG structure can be achieved. It was experimentally verified that the low cutoff frequency is reduced from 2.54 GHz to 2.00 GHz by decreasing the MDGS coupling coefficient, which is associated with the miniaturization of the MDGS-EBG structure in high-speed packages and PCBs.

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Modeling and Analysis of Simultaneous Switching Noise Coupling for a CMOS Negative-Feedback Operational Amplifier in System-in-Package

Cited by 19 publications

References 17 publications

Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling

Genetic Algorithms and Particle Swarm Optimization Mechanisms for Through-Silicon Via (TSV) Noise Coupling

Numerical Laplace Inversion Method for Through-Silicon Via (TSV) Noise Coupling in 3D-IC Design

Meander-DGS Effect on Electromagnetic Bandgap Structure for Power/Ground Noise Suppression in High-Speed Integrated Circuit Packages and PCBs

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