Modeling and analysis on the elastic performance of SMT silicone rubber keypad

Chen, Xuanyou; Ma, Ding; Wang, Siyu; Luo, Zhenhe; Wang, Xiyou; Cai, Miao; Yang, Daoguo

doi:10.1109/icept.2017.8046613

Cited by 3 publications

(2 citation statements)

References 1 publication

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“…Similar conclusions can also be drawn by Zakeri et al and Chen e al. [33,34]. Due to small thickness variations, the contact forces at 1 mm and 2 mm wer not significantly different.…”

Section: Fe Simulation Results and Discussionmentioning

confidence: 96%

Study on the Mechanism of Rootstock Damage during Clamping in Watermelon Grafting

Lou

et al. 2022

Horticulturae

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Rootstock has a soft tissue that should be held carefully to avoid mechanical damage. Holding the rootstock stem is a significant factor in the grafting process, with direct consequences on the survival rate of grafting. To analyze the damage mechanism of clamping rootstock, a finite element model of the clamping mechanism was established, and different clamping velocities and silicone rubber thicknesses were then studied in this study using the finite element method (FEM). The density and elasticity modulus of the rootstock stem and silicone rubber were determined experimentally using standard methods. The results show that as the clamping velocity increased, the contact force on the rootstock stem increased, and the clamping velocity should be lower than the critical velocity to reduce the probability of damage occurrence on the stem. The increase in silicone rubber thickness would decrease the force on the stem, while also resulting in the instability of the rootstock clamping. A silicone rubber thickness of 4 mm was confirmed as an appropriate thickness for this device. The simulation results were compared with the experimental results, and the mean error was 7.01% within the allowable range, which indicated that the FEM simulation model was reliable.

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“…Similar conclusions can also be drawn by Zakeri et al and Chen e al. [33,34]. Due to small thickness variations, the contact forces at 1 mm and 2 mm wer not significantly different.…”

Section: Fe Simulation Results and Discussionmentioning

confidence: 96%

Study on the Mechanism of Rootstock Damage during Clamping in Watermelon Grafting

Lou

et al. 2022

Horticulturae

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“…Because conductive ink is extensively used in silicone keypads, flexible electronic devices [1], radio frequency identification (RFID) systems and many other fields, its performance affects the future direction of printed electronic products [2]. As an essential part of electronic products, conductive silicone keypads have received immense attention, because of their excellent elasticity, tactility, easily decontaminated surfaces, and good anti-aging properties [3]. The silicone keypad's most widely used conductive layer is carbon-based composite conductive ink (3CI).…”

Section: Introductionmentioning

confidence: 99%

Approach to the Modification of Carbon-Based Composite Conductive Ink for Silicone Keypads

et al. 2022

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Carbon-based composite conductive ink (3CI) has some challenges to its properties. Here, combined with the application of 3CI on silicon keypads, a series of studies on the electrical, mechanical and thermal performance of 3CI has been conducted by adding specific concentrations of silver powder, silica powder and SiO2@Ag core-shell particles. The properties of the modified 3CI were characterized by using the four-point probe tester, scanning electron microscope, Rockwell hardness tester, cross-cut tester and laser thermal conductivity analyzer. The experimental results revealed that by adding silver powder with a particle size of 20 microns equivalent to 12% by weight of the 3CI, ink resistance decreased by 76%, from 8.44 kΩ/□ to 2.03 kΩ/□. Meanwhile, adding silica can increase the ink’s tensile strength and thermal diffusivity while improving the adhesion of the 3CI on the silicone rubber. It was worth noting that when the particle size of the SiO2@Ag core-shell particle was smaller than that of the added silver powder, the resistance of the 3CI was further reduced. Finally, a modified 3CI with the adhesion of 4B, a conductivity of about1 kΩ/□, a hardness of 232 HV0.5, and a thermal diffusivity of 0.217 cm2s−1 was achieved experimentally, which provided an experimental basis for the modified 3CI suitable for silicone keypads.

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Design of suction nozzle on a new SMT silicone rubber keypad

Zhong³

et al. 2020

2020 21st International Conference on Electronic Packaging Technology (ICEPT)

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Modeling and analysis on the elastic performance of SMT silicone rubber keypad

Cited by 3 publications

References 1 publication

Study on the Mechanism of Rootstock Damage during Clamping in Watermelon Grafting

Study on the Mechanism of Rootstock Damage during Clamping in Watermelon Grafting

Approach to the Modification of Carbon-Based Composite Conductive Ink for Silicone Keypads

Design of suction nozzle on a new SMT silicone rubber keypad

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