Modeling and characterization of bond-wire arrays for distributed Chip-Package-PCB Co-design

Dinh, Thanh Vinh; Lesénéchal, Dominique; Domengès, B.; Leyssenne, Laurent; Pasquet, Daniel; Descamps, Philippe; Doussin, O.; Wane, Sidina

doi:10.1109/eumc.2015.7345940

Cited by 4 publications

(2 citation statements)

References 10 publications

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“…Depending on specific requirements, such as mechanical stability, thermal management, or adaptability to other transmission lines [12,13,14,15,16], a conductor-back configuration called grounded CPW (GCPW) [9] may be used. The ground-signal-ground (GSG) configuration is suitable for a monolithic microwave integrated circuit (MMIC), as well as for interconnecting a semiconductor chip and package with wire bonding [17,18] or solder bumps for flip-chip techniques [19]. The geometry of a transmission line has a significant impact on its performance, with many parameters highly sensitive to variations in geometry [20,21,22].…”

Section: Introductionmentioning

confidence: 99%

Experimental analysis of grounded coplanar waveguide structures based on different PCB processes with uncertainty analysis

Takahashi,

Hatab,

Schlaffer

et al. 2023

IEICE Electron. Express

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This paper presents an experimental characterization of grounded coplanar waveguides (GCPWs) with uncertainty analysis. GCPW lines to be analyzed were fabricated using different subtractive printed circuit board (PCB) manufacturing processes: panel plating method and pattern plating method. Using a modified multiline method, we have extracted the propagation constants with uncertainty propagation analysis. This considered instrumentation noise, length uncertainty, and impedance mismatch caused by variations in cross-section due to the fabrication capabilities of each manufacturing process. By reformulating the propagation constant, we obtained the attenuation per unit length and the effective relative permittivity as a function of frequencies up to 43.5 GHz with 95% confidence interval. These results showed good agreement with full-wave simulations and highlighted the differences between the PCB manufacturing processes.

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Section: Introductionmentioning

confidence: 99%

Experimental analysis of grounded coplanar waveguide structures based on different PCB processes with uncertainty analysis

Takahashi,

Hatab,

Schlaffer

et al. 2023

IEICE Electron. Express

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show abstract

“…As the actual parasitics associated with the real RF circuits with high packing dense have significant effects on the RFIC performance, the traditional closed-form circuit models may be no longer valid, and co-simulations of the Die circuit or layout Electromagnetics (EM) model and the laminate layout EM model are often considered in order to improve simulation accuracy [5][6][7]. There are some generally considered co-simulation methods [5][6][7][8][9][10] in practical design, such as Die circuit + Laminate Momentum, Die circuit +Laminate HFSS, Die layout Momentum +Laminate Momentum, Die layout Momentum +Laminate HFSS, Die layout +Laminate ADS Nested Technology, etc. Design engineers might be confused about which co-simulation methods should take for RFIC PA design and development.…”

Section: Introductionmentioning

confidence: 99%

Comparison of RFIC PA Die and Laminate Co-Simulation Methods

Liu¹

2018

JEEE

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Package (such as LGA, MCM etc.) with main circuits on Die(s) situated on a substrate and with OMN in the substrate laminate is one of the most popular design styles for RFIC PAs in recent times. In practical design, the overall circuit of the RFIC PA is often designed using ADS Schematic simulation tool. The main circuit is then layout for Die design, and the OMN circuit is layout for laminate design. As the actual parasitics associated with the real RF circuits with high packing dense have significant effects on the RFIC performance, the traditional closed-form circuit models may be no longer valid, and co-simulations of the Die circuit or Die layout EM model and the laminate layout EM model are often considered in order to improve simulation accuracy. There are some generally considered co-simulation methods in practical design, such as Die circuit + Laminate Momentum, Die circuit +Laminate HFSS, Die layout Momentum +Laminate Momentum, Die layout Momentum +Laminate HFSS, Die layout +Laminate ADS Nested Technology, etc. Design engineers might be confused about which co-simulation methods should take for RFIC PA design and development. This paper reviews, compares and discusses the above co-simulation methods in the aspects of algorithms of the simulators, co-simulation modeling method, complexity to build model, run time, and the difference between simulation and measurement results by giving an example of a self-developed RFIC PA operating at 2GHz. It endeavors to draw helpful conclusions for simulation experiences in practical RFIC PA design, and a co-simulation method with Die layout Momentum EM model +Laminate HFSS EM model is recommended based on the software versions used in this work.

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The multi-dimension co-design for the package of the high-speed multi-function chip

Yuan

Wang

et al. 2021

2021 22nd International Conference on Electronic Packaging Technology (ICEPT)

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Modeling and characterization of bond-wire arrays for distributed Chip-Package-PCB Co-design

Cited by 4 publications

References 10 publications

Experimental analysis of grounded coplanar waveguide structures based on different PCB processes with uncertainty analysis

Experimental analysis of grounded coplanar waveguide structures based on different PCB processes with uncertainty analysis

Comparison of RFIC PA Die and Laminate Co-Simulation Methods

The multi-dimension co-design for the package of the high-speed multi-function chip

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