Modeling and characterization of molding compound properties during cure

Jansen, K.M.B.; Qian, Chao; Ernst, L.J.; Böhm, Christoph; Kessler, A.; Preu, H.; Stecher, M.

doi:10.1016/j.microrel.2009.03.007

Cited by 18 publications

(5 citation statements)

References 7 publications

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“…Based on the characterisations, they developed models to predict the warpage and residual stresses. For the details of such modelling and experimental achievements, the reader is recommended to have a look at their published papers [69,74,80,95,96,[105][106][107][108][109][110][111][112][113]. For example, Jansen et al, in 2012 and 2013, developed an analytic model based on classical laminate theory (CLT) for single and multi-layered coating layers used in electronic packaging and predicted the resulting warpage due to the curing process [75,114].…”

Section: Stress Models For Thermoset Polymers and Adhesivesmentioning

confidence: 99%

Prediction Models for Distortions and Residual Stresses in Thermoset Polymer Laminates: An Overview

Abouhamzeh

Sinke

Benedictus

2019

JMMP

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This paper reviews predictive models developed for the development of residual stresses and shape distortions during the manufacturing of thermoset polymeric/composite materials. Different sources that produce residual stresses and shape changes in the laminated panels are described and reviewed. An overview is presented on the characterisation and predictions of the phenomena resulting in residual stresses. The focus will be on the models accounting for the parameters during the cure cycle of the thermoset composite materials published in the literature from 2005 until 2018. The material types covered here range from thermoset adhesives, full composites, and fibre metal laminates. Furthermore, selected works are reviewed on the reduction of the shape changes and residual stresses of composites and fibre metal laminates consisting of thermoset polymers.

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Section: Stress Models For Thermoset Polymers and Adhesivesmentioning

confidence: 99%

Prediction Models for Distortions and Residual Stresses in Thermoset Polymer Laminates: An Overview

Abouhamzeh

Sinke

Benedictus

2019

JMMP

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“…Accurate predictions of the warpage and curing‐induced stresses are important in the microelectronics industry because they are seen as one of the main causes for product failure. We, therefore, took the material data of an actual, well‐characterized molding compound 13. The molding compound was an epoxy resin with an extremely high amount of silica filler (ca.…”

Section: Comparison With Viscoelastic Numerical Simulationsmentioning

confidence: 99%

“…The curing dependency is captured by the changing rubbery modulus [Eq. (25)] and a shift factor ( $ a_{T,\zeta } $ ) that is curing and temperature dependent:13 with as coefficients C 1 = 34.2, C 2 = 140.1 K, T r = 120°C, A 1 = 0.0281, A 2 = −4.059, T c = 102.6°C, d 1 = 25.55, and d 2 = 1.007.…”

Section: Comparison With Viscoelastic Numerical Simulationsmentioning

confidence: 99%

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Analytical estimate for curing‐induced stress and warpage in coating layers

Jansen

Vreugd

Ernst

2012

J of Applied Polymer Sci

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A thermoset coating that is applied to an elastic substrate will develop residual stresses during curing because of polymerization shrinkage of the resin. This shrinkage only partly contributes to the residual stresses because, before gelation, the stresses relax completely. In this study, we developed explicit analytical expressions for the curing efficiency factor, the residual stresses, and the resulting warpage. We did this by assuming that after gelation, the material was in its rubbery state and that viscoelastic effects were absent. A difference between the free and constrained warpages during curing was made. The analytical warpage models were shown to give results comparable to those of the numer-ical calculations with a fully curing-dependent viscoelastic material model. Furthermore, for the first time, accurate analytical expressions for the stress-free temperature and stress-free strain were obtained. With these expressions, the effect of curing shrinkage on the residual stresses could easily be incorporated into existing (numerical) stress analysis without the need for extensive curing-dependent viscoelastic material models.

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“…To ensure stable operation and avoid the influence of environmental factors, such as moisture, corrosion, and external impacts, the cymbal array can be protected by potting [ 1 , 2 ]. Potting is the process of insulating the array with polymeric materials having a high bonding ability, small expansion coefficient, high mechanical endurance, and strong corrosion resistance.…”

Section: Introductionmentioning

confidence: 99%

Selection of a Potting Material and Method for Broadband Underwater Cymbal Arrays

Wang

Shim

Roh

2022

Sensors

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Cymbal transducers are often used in arrays for underwater communication and detection systems. The working environment of a cymbal array is underwater; therefore, waterproofing, salt-corrosion prevention, and impact resistance are necessary for stable operation of the array. Hence, we simulated potting a cymbal array with 15 different rubber and epoxy materials available in the market, using the finite element method, and analyzed their effect on the transmitting voltage response spectrum of the array. From the analysis results, we selected the material that would achieve the widest frequency bandwidth, while preserving the structural stability of the array. A potting method corresponding to the selected material was suggested as well. This study provides guidelines for the selection of a potting material for use in underwater transducer arrays.

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Modeling and characterization of molding compound properties during cure

Cited by 18 publications

References 7 publications

Prediction Models for Distortions and Residual Stresses in Thermoset Polymer Laminates: An Overview

Prediction Models for Distortions and Residual Stresses in Thermoset Polymer Laminates: An Overview

Analytical estimate for curing‐induced stress and warpage in coating layers

Selection of a Potting Material and Method for Broadband Underwater Cymbal Arrays

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