Modeling and impedance matching of bonding wires in multi-chip interconnection of electric sensor

Gao, Kai; Yi, Lei; Wang, Shaojing; bi, chuang; Xu, Peng; Xue, Feng

doi:10.1117/12.3015615

Workshop on Electronics Communication Engineering (WECE 2023) 2024

DOI: 10.1117/12.3015615

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Modeling and impedance matching of bonding wires in multi-chip interconnection of electric sensor

Kai Gao,

Lei Yi,

Shaojing Wang

et al.

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Modeling and impedance matching of bonding wires in multi-chip interconnection of electric sensor

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References 9 publications

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