Modeling and numerical study of thermal-compression bonding in the packaging process using NCA

Chang, Ching Ho; Young, Wen-Bin

doi:10.1016/j.apm.2013.11.026

Cited by 4 publications

(2 citation statements)

References 27 publications

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“…Experimental and numerical studies have been carried out on this problem (Han et al, 1996;Khor et al, 2010;Chang and Young, 2014), which showed that implementation with model strategies based on similar assumptions used in this work are very effective. It was in particular shown that if the gap height is significantly smaller than the gap width, and that the solid elements within the gap are cylindrical rather than spherical, neglecting pressure gradients and fluxes in the height direction in the simulation still allows to model the experiments very well (Nguyen et al, 1999).…”

Section: Significance Of Air Entrapments In Adhesivesmentioning

confidence: 87%

Towards the efficient modelling of trapped air pockets during squeeze flow

Müller

Willenbrock

Stahl

et al. 2022

Exp. Comput. Multiph. Flow

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In most bonding processes, an adhesive is applied to a substrate in a specific pattern before the second substrate is subsequently pressed against it. During this, the adhesive flows in such a way that, ideally, it completely fills the joint. In practice, however, areas with entrapped air frequently remain in the bonded adhesive layer. Within the scope of a research project, these flows are systematically analyzed in order to identify optimal initial application patterns for the adhesive and substrate geometry to minimise such risks. For this purpose, the authors use an efficient flow model, the partially filled gaps model (PFGM), extended in this study to include the functionality of trapped air pockets. Depending on the volume fractions of air and adhesive, the flow of both phases is computed. Therefore, the model is introduced and fully described, benchmarked with respect to its plausibility and functionality, and results obtained are compared with a CFD calculation. Thereafter, the functionality of openings and closings of the pockets are analyzed. Lastly, the model is then applied to a real scenario created with a Hele-Shaw cell measurement. The benchmark as well as the comparison with the measurement results show the high potential of this technique.

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Section: Significance Of Air Entrapments In Adhesivesmentioning

confidence: 87%

Towards the efficient modelling of trapped air pockets during squeeze flow

Müller

Willenbrock

Stahl

et al. 2022

Exp. Comput. Multiph. Flow

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show abstract

“…Qin et al (2014) claimed that the warpage increased significantly with an increase in the interposer size in flip-chip packages. Lowering the bonding temperature turned out to be the dominant factor for decreasing the maximum warpage for a problem concerning a chip on glass packaging process with non-conductive adhesives (Chang and Young, 2014). Zhou et al (2015) proposed a pre-warping method to reduce warpage without increasing the residual stress.…”

Section: Introductionmentioning

confidence: 99%

Time-based reflow soldering optimization by using adaptive Kriging-HDMR method

Chen

Wang

2016

SSMT

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Purpose Reflow soldering process is an important step of the surface mount technology. The purpose of this paper is to minimize the maximum warpage of shielding frame by controlling reflow soldering control parameters. Design/methodology/approach Compared with other reflow-related design methods, both time and temperate of each extracted time region are considered. Therefore, the number of design variable is increased. To solve the high-dimensional problem, a surrogate-assisted optimization (SAO) called adaptive Kriging high-dimensional representation model (HDMR) is used. Findings Therefore, the number of design variable is increased. To solve the high-dimensional problem, a surrogate-assisted optimization (SAO) called HDMR is used. The warpage of shield frame is significantly reduced. Moreover, the correlations of design variables are also disclosed. Originality/value Compared with the original Kriging HDMR, the expected improvement (EI) criterion is used and a new projection strategy is suggested to improve the efficiency of optimization method. The application suggests that the adaptive Kriging HDMR has potential capability to solve such complicated engineering problems.

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Ways to Mitigate Thermal Stresses in Adhesively Bonded Joints/Patches

Apalak

2017

Progress in Adhesion and Adhesives

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Modeling and numerical study of thermal-compression bonding in the packaging process using NCA

Cited by 4 publications

References 27 publications

Towards the efficient modelling of trapped air pockets during squeeze flow

Towards the efficient modelling of trapped air pockets during squeeze flow

Time-based reflow soldering optimization by using adaptive Kriging-HDMR method

Ways to Mitigate Thermal Stresses in Adhesively Bonded Joints/Patches

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