2013
DOI: 10.1007/s00170-013-4989-7
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Modeling and predicting for surface topography considering tool wear in milling process

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Cited by 36 publications
(11 citation statements)
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“…The results show that the random morphology has a great influence on the flow loss and therefore cannot be ignored. Zhang et al [18] proposed a milling topography simulation model considering tool wear. The experimental results of cutting under plane and cylindrical surfaces are in good agreement with the model prediction, which proves the correctness of the model.…”
Section: Appl Sci 2018 8 X For Peer Review 3 Of 18mentioning
confidence: 99%
“…The results show that the random morphology has a great influence on the flow loss and therefore cannot be ignored. Zhang et al [18] proposed a milling topography simulation model considering tool wear. The experimental results of cutting under plane and cylindrical surfaces are in good agreement with the model prediction, which proves the correctness of the model.…”
Section: Appl Sci 2018 8 X For Peer Review 3 Of 18mentioning
confidence: 99%
“…The rotation angle corresponding to position angle ϕ can be obtained by the method in Zhang et al [18]. Thus, the obtained parameters are substituted into the cutting trajectory Eq.…”
Section: The Generation Of Surface Topographymentioning
confidence: 99%
“…In our previous work, a model for the prediction of surface topography considering tool wear during the milling process was established based on the established cutting path equation, which can be transformed into equivalent polynomial equations and solved for discrete positions along the feed direction, and was suitable for surface topography modeling in three-axis milling operation [18].…”
Section: Introductionmentioning
confidence: 99%
“…An epoxy hybrid with in situ developed a three‐dimensional inorganic network structure by sol‐gel method displayed higher values of the thermal degradation activation energy than the epoxy resin , . Low melting glasses with O‐P‐O‐Si chain building segments were prepared from orthophosphoric or phenylphosphonic acid with chlorotrimethylsilane (CTMS) or methyltrichlorosilane, respectively, at elevated temperatures up to 200 °C , …”
Section: Introductionmentioning
confidence: 99%