Modeling and simulating electronic textile applications

Abstract

This paper describes our design of a simulation environment for electronic textiles (e-textiles) and our experiences with that environment. This simulation environment, based upon Ptolemy II, enables us to model a diverse range of areas related to the design of electronic textiles, including the physical environment they will be used in, the behavior of the sensors incorporated into the fabric, the on-fabric network, the power consumption of the system, and the execution of the application and system software. This paper focuses on two aspects of the system, modeling the motion of a person wearing the e-textile and modeling the effect of faults in the e-textile system. To partially validate this environment, we compare simulation results against results from two different physical prototypes, a large-scale acoustic beamformer and a pair of shape-sensing pants.

Variability Analysis on the Parameters of Pulse Wave

“…The complexity of the variability of these features of pulse wave had little difference. With the development of wearable physiological signals monitoring system, [8] the variability analysis of physiological signal will disclose more and more information on human physical conditions. Our future work includes the development of wearable pulse monitoring system and put forward noninvasive pulse diagnosis and monitoring device with intelligent signal interpretation is our major focus in forthcoming years.…”

Stress Analysis and Optimization of a Flip Chip on Flex Electronic Packaging Method for Functional Electronic Textiles

“…Electronic textile (e-textiles) technology seeks to further integrate microelectronics technology by combining electronics with textiles to enable a new class of product [1]. An e-textile is a textile with integrated electronic functionality [2], and this can be used in fashion, medical, and military applications [3], [4]. In one approach to realize e-textiles, flip-chip technology is used to mount ultrathin die onto thin flexible plastic film strips that contain patterned conductive interconnects and bond pads.…”

Detecting bends and fabric folds using stitched sensors

“…Textile folds have been known to present difficult variables for wearable body-sensing applications [1]. For example, an inertial sensor may be turned 180 degrees or more due to a textile fold.…”