2011 IEEE International Symposium on Industrial Electronics 2011
DOI: 10.1109/isie.2011.5984180
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Modeling and simulating the lightning phenomenon: Aeronautic materials comparison in conducted and radiated modes

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Cited by 3 publications
(3 citation statements)
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“…This proposed modeling process has proved to be very efficient not only for high current electrical systems (Gonnet et al, 2004) but also power electronics devices and structures (Aimé et al, 2009a), electronic card (Clavel et al, 2007a), PCB application (Vialardi et al, 2010) and aircraft structures (Jazzar et al, 2011).…”
Section: Fig 10 Modeling Processmentioning
confidence: 99%
“…This proposed modeling process has proved to be very efficient not only for high current electrical systems (Gonnet et al, 2004) but also power electronics devices and structures (Aimé et al, 2009a), electronic card (Clavel et al, 2007a), PCB application (Vialardi et al, 2010) and aircraft structures (Jazzar et al, 2011).…”
Section: Fig 10 Modeling Processmentioning
confidence: 99%
“…Indeed, according the frequency range, this dependence can be negligible and if not, numerical techniques to find a non dependent circuit with more components exist (Tan & He, 2007). This proposed modeling process has proved to be very efficient not only for high current electrical systems (Gonnet et al, 2004) but also power electronics devices and structures (Aimé et al, 2009a), electronic card (Clavel et al, 2007a), PCB application (Vialardi et al, 2010) and aircraft structures (Jazzar et al, 2011).…”
Section: It Consists Of Four Stepsmentioning
confidence: 99%
“…Since then, there has been a growing interest in the PEEC method which has been applied to a large variety of different fields including power electronics [15], [16], [17], [18], [19], [20], power systems [21], [22], antennas [23], [24], [25], [26], [27], [28], [29], [30], radio-frequency integrated circuits (RFICs) [31], [32] and RF interferences [33], lightning [34], [35], [36], filters [37], [38], on-chip interconnects [39], frequency selective surfaces [40], [41], [42], Litz wires [43], [44], [45], [46], neuromorphic chip crossbar array [47], flexible electronics [48], [49], high-temperature superconducting (HTS) cables [50], decoupling capacitors [51], wireless power transfer [52], [53], [54], and return network in composoite aircraft [55], just to name a few. The list of applications and contributors increases continuously due to recent improvements.…”
mentioning
confidence: 99%