Modeling and Simulation Challenges and Solutions in Cooling Systems for Nanoscale Integrated Circuits [Feature]

Terraneo, Federico; Leva, Alberto; Fornaciari, William; Atienza, David

doi:10.1109/mcas.2023.3234727

IEEE Circuits Syst. Mag.

2023

DOI: 10.1109/mcas.2023.3234727

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Modeling and Simulation Challenges and Solutions in Cooling Systems for Nanoscale Integrated Circuits [Feature]

Federico Terraneo

Alberto Leva

William Fornaciari

et al.

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Modeling and Simulation Challenges and Solutions in Cooling Systems for Nanoscale Integrated Circuits [Feature]

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