Modeling and Simulation of Oxygen Precipitation in CZ Silicon

Abstract

This paper describes modeling and simulation for the growth and dissolution of oxygen precipitates in Czochralski silicon(CZ) wafers during heat treatment. Growth and dissolution rates arc newly derived and inserted into a set of chemical rate equations(CILEs) and a Fokkor-Planck equation(FPE). Annealing ambients and surface conditions are taken into account for solving continuity equations in order to calculate oxygon depth profile and oxygen precipitates density more precisely.