2022
DOI: 10.1016/j.jmps.2022.105089
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Modeling interfacial instability patterns during debonding a rigid spherical indenter from thin elastic films

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Cited by 5 publications
(2 citation statements)
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“…[8] However, any slip between the luminescent layer and the electrode diminishes the transfer of strain from the electrode to the luminescent layer, limiting the tunability of flexible electronic devices. [9] When the electrode deforms, the slip between the luminescent layer and the substrate may also cause wrinkles or peeling of the luminescent layer, leading to a deterioration in device performance. [10] However, there is little research on improving the interfacial adhesion between organic electroluminescent materials and the substrate.…”
Section: Introductionmentioning
confidence: 99%
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“…[8] However, any slip between the luminescent layer and the electrode diminishes the transfer of strain from the electrode to the luminescent layer, limiting the tunability of flexible electronic devices. [9] When the electrode deforms, the slip between the luminescent layer and the substrate may also cause wrinkles or peeling of the luminescent layer, leading to a deterioration in device performance. [10] However, there is little research on improving the interfacial adhesion between organic electroluminescent materials and the substrate.…”
Section: Introductionmentioning
confidence: 99%
“…When it comes to flexible electronic devices, the strain of the luminescent layer is achieved through deformation of the substrate [8] . However, any slip between the luminescent layer and the electrode diminishes the transfer of strain from the electrode to the luminescent layer, limiting the tunability of flexible electronic devices [9] . When the electrode deforms, the slip between the luminescent layer and the substrate may also cause wrinkles or peeling of the luminescent layer, leading to a deterioration in device performance [10] .…”
Section: Introductionmentioning
confidence: 99%