2007
DOI: 10.1007/s11664-007-0218-1
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Modeling Material Properties of Lead-Free Solder Alloys

Abstract: A full set of physical and thermophysical properties for lead-free solder (LFS) alloys have been calculated, including liquidus/solidus temperatures, fraction solid, density, coefficient of thermal expansion, thermal conductivity, YoungÕs modulus, viscosity, and liquid surface tension, all as a function of composition and temperature (extending into the liquid state). The results have been extensively validated against data available in the literature. A detailed comparison of the properties of two LFS alloys … Show more

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Cited by 31 publications
(19 citation statements)
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“…It is a Java based material processing software which calculates phase equilibria of multi‐component alloys based on the CALPHAD (Calculation of Phase Diagrams) method . For each individual phase in multi‐component systems, properties, such as molar volume, thermal conductivity, Young's modulus, and Poisson's ratio are calculated using simple pair‐wise mixture models . First, isothermal phase transformation curves of ferrite, pearlite, and bainite are calculated and depicted in a Time Temperature Transformation diagram (TTT) .…”
Section: State Of the Artmentioning
confidence: 99%
“…It is a Java based material processing software which calculates phase equilibria of multi‐component alloys based on the CALPHAD (Calculation of Phase Diagrams) method . For each individual phase in multi‐component systems, properties, such as molar volume, thermal conductivity, Young's modulus, and Poisson's ratio are calculated using simple pair‐wise mixture models . First, isothermal phase transformation curves of ferrite, pearlite, and bainite are calculated and depicted in a Time Temperature Transformation diagram (TTT) .…”
Section: State Of the Artmentioning
confidence: 99%
“…In photovoltaic (PV) modules, made of crystalline silicon solar cells, cracking of silicon near soldered metallic interconnects has been widely observed and reported [1][2][3][4][5]. In order to identify the cause of cell cracking, the module integration process needs to be thoroughly understood and magnitudes of the residual stress at different process steps need to be evaluated.…”
Section: Introductionmentioning
confidence: 99%
“…At these high temperatures of soldering and lamination (also called encapsulation), because of mismatch of CTE, constituent materials tend to develop differential thermal strain and thus high residual stress. These internal residual stresses are detrimental to the reliability of the solar cells and modules as they act as stress localization centers and initiate cracking and failure during the operation of the module [1][2][3][4][5]. Further, with the thinning of the silicon wafer to reduce cost, the silicon cell becomes even more susceptible to cracking because of higher residual stresses [2,3].…”
Section: Introductionmentioning
confidence: 99%
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