Modeling of continuous dynamic recrystallization in commercial-purity aluminum

A coupled diffusion-deformation, multiphase field model for elastoplastic materials is presented. The equations governing the evolution of the phase fields and the molar concentration field are derived in a thermodynamically consistent way using microforce balance laws. As an example of its capabilities, the model is used to study the growth of the intermetallic compound (IMC) Cu 6 Sn 5 during room-temperature aging. This IMC is of great importance in, e.g., soldering of electronic components. The model accounts for grain boundary diffusion between IMC grains and plastic deformation of the microstructure. A plasticity model with hardening, based on an evolving dislocation density, is used for the Cu and Sn phases. Results from the numerical simulations suggest that the thickness of the IMC layer increases linearly with time and that the morphology of the IMC gradually changes from scallop-like to planar, consistent with previous experimental findings. The model predicts that plastic deformation occurs in both the Cu and the Sn layers. Furthermore, the mean value of the biaxial stress in the Sn layer is found to saturate at a level of −8 MPa to −10 MPa during aging. This is in good agreement with experimental data.

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“…Following Hallberg et al [28] the evolution of the dislocation density is given by a classical Kocks-Mecking law of the formρ…”

Section: Dissipation Potentialmentioning

confidence: 99%

Coupled diffusion-deformation multiphase field model for elastoplastic materials applied to the growth of Cu6Sn5

et al. 2016

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“…By this approach, recrystallization is not activated until ε p eff ≥ ε p c . This approach is used in a finite strain, visco-plastic, constitutive model of recrystallization in [60]. Such a macroscopic recrystallization criterion is also discussed in relation to analytical models and experimental results in [61][62][63].…”

Section: Continuum Mechanical Modelsmentioning

confidence: 99%

“…The McCauley brackets · indicate that no recrystallization will occur until the recrystallization criterion ε p eff > ε p c is met. Expressions for the recrystallized grain size as formulated in Equation (14) have been used in [60][61][62][63][66][67][68][69][70].…”

Section: Continuum Mechanical Modelsmentioning

confidence: 99%

Approaches to Modeling of Recrystallization

Hallberg

2011

Metals

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157

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Control of the material microstructure in terms of the grain size is a key component in tailoring material properties of metals and alloys and in creating functionally graded materials. To exert this control, reliable and efficient modeling and simulation of the recrystallization process whereby the grain size evolves is vital. The present contribution is a review paper, summarizing the current status of various approaches to modeling grain refinement due to recrystallization. The underlying mechanisms of recrystallization are briefly recollected and different simulation methods are discussed. Analytical and empirical models, continuum mechanical models and discrete methods as well as phase field, vertex and level set models of recrystallization will be considered. Such numerical methods have been reviewed previously, but with the present focus on recrystallization modeling and with a rapidly increasing amount of related publications, an updated review is called for. Advantages and disadvantages of the different methods are discussed in terms of applicability, underlying assumptions, physical relevance, implementation issues and computational efficiency.

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“…The dislocation density ρ in a grain, with diameter d, is assumed to evolve according to a Kocks-Mecking relation, cf. [14,15,16,17], i.e.…”

Section: Evolution Laws and Recrystallization Kinematicsmentioning

confidence: 99%

Simulation of discontinuous dynamic recrystallization in pure Cu using a probabilistic cellular automaton

Hallberg

Wallin

Ristinmaa

2010

Computational Materials Science

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113

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A cellular automaton algorithm with probabilistic cell switches is employed in the simulation of dynamic discontinuous recrystallization. Recrystallization kinetics are formulated on a microlevel where, once nucleated, new grains grow under the driving pressure available from the competing processes of stored energy minimization and boundary energy reduction. Simulations of the microstructural changes in pure Cu under hot compression are performed where the influence of different thermal conditions are studied. The model is shown to capture both the microstructural evolution in terms of grain size and grain shape changes and also the macroscopic flow stress behavior of the material. The latter gives the expected transition from single-to multiple-peak serrated flow with increasing temperature. Further, the effects on macroscopic flow stress by varying the initial grain size is analyzed and the model is found to replicate the shift towards more serrated flow as the initial grain size is reduced. Conversely, the flow stress is stabilized by larger initial grain sizes. The extent of recrystallization as obtained from simulations are compared to classical JMAK theory and proper agreement with theory is established. In addition, by tracing the strain state during the simulations, a post-processing step is devised to obtain the macroscopic deformation of the cellular automaton domain, giving the expected deformation of the equiaxed recrystallized grains due to the macroscopic compression.

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Modeling of continuous dynamic recrystallization in commercial-purity aluminum

Cited by 93 publications

References 55 publications

Coupled diffusion-deformation multiphase field model for elastoplastic materials applied to the growth of Cu6Sn5

Coupled diffusion-deformation multiphase field model for elastoplastic materials applied to the growth of Cu6Sn5

Approaches to Modeling of Recrystallization

Simulation of discontinuous dynamic recrystallization in pure Cu using a probabilistic cellular automaton

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