Modeling of Cube-Texture Evolution during Grain Growth in Ni Thick-Films based on Experimental Observations

Zhang, Yu Bin; Godfrey, A.; Miodownik, Mark; Liu, Wei; Qing, Liu

doi:10.4028/www.scientific.net/msf.558-559.1043

Cited by 3 publications

(3 citation statements)

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“…2a). This result is in agreement with previous research, 25 where it was shown that cube texture fraction increases during grain growth due to advantages both of size and volume fraction.…”

Section: Microstructure Evolutionsupporting

confidence: 94%

Investigation of boundary migration during grain growth in fully recrystallised high purity nickel

Zhang¹,

Godfrey²,

Liu³

et al. 2010

Materials Science and Technology

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The movement of individual boundaries during grain growth after primary recrystallisation in a 96% cold rolled sample of pure nickel has been followed using electron backscatter diffraction maps of the same surface area taken after each of several annealing steps. Particular attention is given to the migration of boundaries with near Σ3 misorientations. During annealing, a small reduction in the length fraction the Σ3 boundaries was observed in the early stages of annealing. Analysis of individual boundaries shows that only those boundary segments with a misorientation angle greater than 4° move during annealing. In addition, the Σ3 boundaries can be divided into two groups: those with misorientations very close to the ideal twin misorientation (‘twin type') and those with a larger deviation to the ideal twin misorientation, but still satisfying the Brandon criterion (‘neighbour type'). Of these, only neighbour type Σ3 boundaries are observed to move during annealing. Some implications of these observations for twin development during grain boundary engineering are discussed.

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“…2a). This result is in agreement with previous research, 25 where it was shown that cube texture fraction increases during grain growth due to advantages both of size and volume fraction.…”

Section: Microstructure Evolutionsupporting

confidence: 94%

Investigation of boundary migration during grain growth in fully recrystallised high purity nickel

Zhang¹,

Godfrey²,

Liu³

et al. 2010

Materials Science and Technology

View full text Add to dashboard Cite

show abstract

“…The strongest cube texture can be obtained when the fraction of cube texture after primary recrystallization is the highest [11]. For the Cu-45 at%Ni substrates with and without surface shear, the above results show that the deformation texture and recrystallization is hampered by the surface shear.…”

Section: Resultsmentioning

confidence: 63%

“…The investigation of the mechanism of cube texture development in Ni substrates has confirmed that the strong cube texture obtained after a high temperature annealing is depended on the cube texture formation during recrystallization [11]. The strongest cube texture can be obtained when the fraction of cube texture after primary recrystallization is the highest [11].…”

Section: Resultsmentioning

confidence: 67%

Effect of surface shear on cube texture formation in heavy cold-rolled Cu–45at%Ni alloy substrates

et al. 2015

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Cube texture evolution of Ni5W alloy substrates and La–Zr–O buffer layer of YBCO-coated conductors

et al. 2016

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Modeling of Cube-Texture Evolution during Grain Growth in Ni Thick-Films based on Experimental Observations

Cited by 3 publications

References 0 publications

Investigation of boundary migration during grain growth in fully recrystallised high purity nickel

Investigation of boundary migration during grain growth in fully recrystallised high purity nickel

Effect of surface shear on cube texture formation in heavy cold-rolled Cu–45at%Ni alloy substrates

Cube texture evolution of Ni5W alloy substrates and La–Zr–O buffer layer of YBCO-coated conductors

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