Modeling of long-term creep behavior of structural epoxy adhesives

Feng, Chao; Keong, Chi-Wah; Hsueh, Ying-Pin; Wang, Y.-Y.; Sue, Hung‐Jue

doi:10.1016/j.ijadhadh.2004.11.009

Cited by 92 publications

(47 citation statements)

References 22 publications

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“…a r c h i v e s o f c i v i l a n d m e c h a n i c a l e n g i n e e r i n g x x x ( 2 0 1 5 ) x x x -x x x Therefore, this specimen was left till the failure happened, which was almost eight days after the last data point recorded. This might verify the estimation by Burger's model and, also, might be evidence of the disability of Findley's model to describe the creep behaviour for longer time due to the unlimited retardation spectrum of this model [11]. Table 4 lists the parameters of the steady-state creep rate approach.…”

Section: 4supporting

confidence: 64%

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Expectancy of the lifetime of bonded steel joints due to long-term shear loading

Sahellie¹,

Pasternak²

2015

Archives of Civil and Mechanical Engineering

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Section: 4supporting

confidence: 64%

“…Findley's model, which indicated by huge relative errors, is not useful for predicting long lifetimes due to the unlimited retardation spectrum of that model [11].…”

Section: Discussionmentioning

confidence: 99%

Expectancy of the lifetime of bonded steel joints due to long-term shear loading

Sahellie¹,

Pasternak²

2015

Archives of Civil and Mechanical Engineering

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“…Additionally, the analysed specialized bibliography on this topic revealed that the mechanical performance of adhesives changes in fact with time, mainly due to the level of applied stress, but also due to environmental conditions such as temperature and humidity, as referred by ASTM, Dean and Feng et al [10][11][12].…”

Section: Introductionmentioning

confidence: 99%

Tensile creep of a structural epoxy adhesive: Experimental and analytical characterization

Costa

Barros

2015

International Journal of Adhesion and Adhesives

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a b s t r a c tEpoxy adhesives are nowadays being extensively used in Civil Engineering applications, mostly in the scope of the rehabilitation of reinforced concrete (RC) structures. In this context, epoxy adhesives are used to provide adequate stress transference from fibre reinforced polymers (FRP) to the surrounding concrete substrate. Most recently, the possibility of using prestressed FRPs bonded with these epoxy adhesives is also being explored in order to maximize the potentialities of this strengthening approach. In this context, the understanding of the long term behaviour of the involved materials becomes essential. Even when non-prestressed FRPs are used a certain amount of stress is permanently applied on the adhesive interface during the serviceability conditions of the strengthened structure, and the creep of the adhesive may cause a continuous variation in the deformational response of the element. In this context, this paper presents a study aiming to experimentally characterize the tensile creep behaviour of an epoxy-based adhesive currently used in the strengthening of concrete structures with carbon FRP (CFRP) systems. To analytically describe the tensile creep behaviour, the modified Burgers model was fitted to the experimental creep curves, and the obtained results revealed that this model is capable of predicting with very good accuracy the long term behaviour of this material up to a sustained stress level of 60% of the adhesive's tensile strength.

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“…At the fiber array interface, small deformations of the epoxy glue over time [27] due to e.g. small thermal variations, alters the position of the output fibers above the grating couplers slightly.…”

Section: Switching Experiments With 70 MM Glucosementioning

confidence: 99%

Glucose sensing by waveguide-based absorption spectroscopy on a silicon chip

Ryckeboer

Bockstaele

Vanslembrouck

et al. 2014

Biomed. Opt. Express

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Abstract:In this work, we demonstrate in vitro detection of glucose by means of a lab-on-chip absorption spectroscopy approach. This optical method allows label-free and specific detection of glucose. We show glucose detection in aqueous glucose solutions in the clinically relevant concentration range with a silicon-based optofluidic chip. The sample interface is a spiral-shaped rib waveguide integrated on a silicon-on-insulator (SOI) photonic chip. This SOI chip is combined with micro-fluidics in poly(dimethylsiloxane) (PDMS). We apply aqueous glucose solutions with different concentrations and monitor continuously how the transmission spectrum changes due to glucose. Based on these measurements, we derived a linear regression model, to relate the measured glucose spectra with concentration with an error-of-fitting of only 1.14 mM. This paper explains the challenges involved and discusses the optimal configuration for on-chip evanescent absorption spectroscopy. In addition, the prospects for using this sensor for glucose detection in complex physiological media (e.g. serum) is briefly discussed.

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Modeling of long-term creep behavior of structural epoxy adhesives

Cited by 92 publications

References 22 publications

Expectancy of the lifetime of bonded steel joints due to long-term shear loading

Expectancy of the lifetime of bonded steel joints due to long-term shear loading

Tensile creep of a structural epoxy adhesive: Experimental and analytical characterization

Glucose sensing by waveguide-based absorption spectroscopy on a silicon chip

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