2009 International Conference on Electronic Packaging Technology &Amp; High Density Packaging 2009
DOI: 10.1109/icept.2009.5270706
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Modeling of nanostructured polymer-metal composite for thermal interface material applications

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Cited by 3 publications
(2 citation statements)
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“…As revealed in Figure 2d, temperature oscillations increase with decreasing PI thickness mainly due to the higher thermal conductivity of PI than silicone. [26,27] Overall, experimental results (represented as dots) agree well with analytical solutions (dash lines) and FEA values (solid lines) at all frequencies. Further validation of FEA models and calculations follow from comparisons against previous methods, [1] in which the thermal conductivity can be extracted from the slope of the in-phase component of the temperature oscillation versus ln(ω).…”
supporting
confidence: 68%
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“…As revealed in Figure 2d, temperature oscillations increase with decreasing PI thickness mainly due to the higher thermal conductivity of PI than silicone. [26,27] Overall, experimental results (represented as dots) agree well with analytical solutions (dash lines) and FEA values (solid lines) at all frequencies. Further validation of FEA models and calculations follow from comparisons against previous methods, [1] in which the thermal conductivity can be extracted from the slope of the in-phase component of the temperature oscillation versus ln(ω).…”
supporting
confidence: 68%
“…The temperature increase in the Au wire was uniform because the thermal conductivity of Au (400 W/mK) is three orders of magnitude larger than that of the Ecoflex substrate (0.21 W/mK) and the PI layer (0.52 W/mK). [27] For the serpentine Au wire, thermal analysis used 3D element DC3D8. including biological tissues such as the human skin.…”
mentioning
confidence: 99%