The process of deep
texturization of the crystalline silicon surface
is intimately related to its promising diverse applications, such
as bactericidal surfaces for integrated lab-on-chip devices and absorptive
optical layers (black silicon—BSi). Surface structuring by
a maskless texturization appeals as a cost-effective approach, which
is up-scalable for large-area production. In the case of silicon,
it occurs by means of reactive plasma processes (RIE—reactive-ion
etching) using fluorocarbon CF
4
and H
2
as reaction
gases, leading to self-assembled cylindrical and pyramidal nanopillars.
The mechanism of silicon erosion has been widely studied and described
as it is for the masked RIE process. However, the onset of the erosion
and the reaction kinetics leading to defined maskless patterning have
not been unraveled to date. In this work, we specifically tackle this
issue by analyzing the results of three different RIE recipes, specifically
designed for the purpose. The mechanism of surface self-nanopatterning
is revealed by deeply investigating the physical chemistry of the
etching process at the nanoscale and the evolution of surface morphology.
We monitored the progress in surface patterning and the composition
of the etching plasma at different times during the RIE process. We
confirm that nanopattering issues from a net erosion, as contributed
by chemical etching, physical sputtering, and by the synergistic plasma
effect. We propose a qualitative model to explain the onset, the evolution,
and the stopping of the process. As the RIE process is started, a
high density of surface defects is initially created at the free silicon
surface by energetic ion sputtering. Contextually, a polymeric overlayer
is synthesized on the Si surface, as thick as 5 nm on average, and
self-aggregates into nanoclusters. The latter phenomenon can be explained
by considering that the initial creation of surface defects increases
the activation energy for surface diffusion of deposited CF and CF
2
species and prevents them from aggregating into a continuous
Volmer–Weber polymeric film. The clusterization of the polymer
provides the self-masking effect since the beginning, which eventually
triggers surface patterning. Once started, the maskless texturing
proceeds in analogy with the masked case, that is, by combined chemical
etching and ion sputtering, and ceases because of the loss of ion
energy. In the case of CF
4
/H
2
RIE processes
at 10% of H
2
and by supplying 200 W of RF power for 20
min, nanopillars of 200 nm in height and 100 nm in width were formed.
We therefore propose that a precise assessment of surface defect formation
and density in dependence on the initial RIE process parameters can
be the key to open a full control of outcomes of maskless patterning.