2006
DOI: 10.1016/j.mee.2005.12.001
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Modeling of silicon oxynitride etch microtrenching using genetic algorithm and neural network

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Cited by 16 publications
(5 citation statements)
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“…A statistical experimental design was used to make the NN training most cost effective, whereas GA was used to find out the NN weight factors. [134][135][136] Kim et al 137,138 adopted a GA based methodology that enables a user to design a modal transducer for two-dimensional structures with arbitrary geometry and boundary conditions. The gain distribution was approximated by optimising electrode patterns, lamination angles and relative poling directions of the multilayered polyvinylidene fluoride transducer.…”
Section: Other Polymer Applicationsmentioning
confidence: 99%
“…A statistical experimental design was used to make the NN training most cost effective, whereas GA was used to find out the NN weight factors. [134][135][136] Kim et al 137,138 adopted a GA based methodology that enables a user to design a modal transducer for two-dimensional structures with arbitrary geometry and boundary conditions. The gain distribution was approximated by optimising electrode patterns, lamination angles and relative poling directions of the multilayered polyvinylidene fluoride transducer.…”
Section: Other Polymer Applicationsmentioning
confidence: 99%
“…The first layer is fully connected to the pattern layer, whose output is a measure of the distance of the input from the stored patterns. Each pattern layer unit is connected to the two neurons in the summation layer, known as S summation neuron and D summation neuron [12] . The S summation neuron computes the sum of the weighted outputs of the pattern layer while the D summation neuron calculates the unweighted outputs of the pattern neurons.…”
Section: Neural Network Architecture and Training Algorithmmentioning
confidence: 99%
“…Moreover, semiconductor and integrated circuit manufacturing industry is highly suitable to be integrated with DL techniques because the semiconductor manufacturing process encounters a large number of parameters and a various number of procedures that are inevitable to be performed manually by engineers. There is some prior research based on the integration of ML with semiconductor manufacturing [27][28][29][30]. In [31], a ML algorithm was reported for defect detection.…”
Section: Introductionmentioning
confidence: 99%