Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad

Wong, Javier Chen; Soon, Kok Heng; Kim, Hyeon Cheol; Kho, David Ching Tien; Chan, Colin Yii Wen

doi:10.1016/j.microrel.2023.115240

Microelectronics Reliability

2023

DOI: 10.1016/j.microrel.2023.115240

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Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad

Javier Chen Wong,

Kok Heng Soon,

Hyeon Cheol Kim

et al.

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2024

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Cited by 1 publication

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A Novel Out-of-Control Action Plan (OCAP) for Optimizing Efficiency and Quality in the Wafer Probing Process for Semiconductor Manufacturing

Yeo,

Chang,

Chen

et al. 2024

Sensors

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The out-of-control action plan (OCAP) is crucial in the wafer probing process of semiconductor manufacturing as it systematically addresses and corrects deviations, ensuring the high quality and reliability of semiconductor devices. However, the traditional OCAP involves many redundant and complicated processes after failures occur on production lines, which can delay production and escalate costs. To overcome the traditional OCAP’s limitations, this paper proposes a novel OCAP aimed at enhancing the wafer probing process in semiconductor manufacturing. The proposed OCAP integrates proactive measures such as preventive maintenance and advanced monitoring technologies, which are tested and verified through a comprehensive experimental setup. Implementing the novel OCAP in a case company’s production line reduced machine downtime by over 24 h per week and increased wafer production by about 23 wafers per week. Additionally, probe test yield improved by an average of 1.1%, demonstrating the effectiveness of the proposed method. This paper not only explores the implementation of the novel OCAP but also compares it with the traditional OCAP, highlighting significant improvements in efficiency and production output. The results underscore the potential of advanced OCAP to enhance manufacturing processes by reducing dependency on human judgment, thus lowering the likelihood of errors and improving overall equipment effectiveness (OEE).

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A Novel Out-of-Control Action Plan (OCAP) for Optimizing Efficiency and Quality in the Wafer Probing Process for Semiconductor Manufacturing

Yeo,

Chang,

Chen

et al. 2024

Sensors

View full text Add to dashboard Cite

show abstract

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Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad

Cited by 1 publication

References 19 publications

A Novel Out-of-Control Action Plan (OCAP) for Optimizing Efficiency and Quality in the Wafer Probing Process for Semiconductor Manufacturing

A Novel Out-of-Control Action Plan (OCAP) for Optimizing Efficiency and Quality in the Wafer Probing Process for Semiconductor Manufacturing

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