2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2024
DOI: 10.1109/itherm55375.2024.10709606
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Modeling of the Temperature Cycling Performance of BGA Packages with Hybrid SAC-LTS Joints and Various Bi Concentration Gradients

Souvik Chakraborty,
Debabrata Mondal,
Jeffrey C. Suhling
et al.
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