2019
DOI: 10.2351/1.5104318
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Modeling of thermal and solidification behavior during laser additive manufacturing of AlSi10Mg alloy powders and its experimental validation

Abstract: In the present era, the laser additive manufacturing process is widely adopted in the manufacturing sector to produce near net shape components with minimum wastage of raw materials. Direct metal laser sintering (DMLS) is one of the laser additive manufacturing techniques which has received the most attention, as it builds the parts directly from metal or alloy powders. However, the quality of the components produced by DMLS has hindered its use on a larger scale. The process parameters in the DMLS process dir… Show more

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Cited by 26 publications
(2 citation statements)
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“…The AlSi10Mg alloy contains a small quantity of Mg (0.3 wt%-0.5 wt%), which induced a hardening effect via the generation of Mg 2 Si precipitates. The selective laser-melting process is usually adopted for the fabrication of small AlSi10Mg alloy components, where Mg easily evaporates [46]. If the VPPAbased additive manufacturing is used, element loss from the bead can be suppressed.…”
Section: The Influences Of Energy Transfer On the Keyhole Temperature...mentioning
confidence: 99%
“…The AlSi10Mg alloy contains a small quantity of Mg (0.3 wt%-0.5 wt%), which induced a hardening effect via the generation of Mg 2 Si precipitates. The selective laser-melting process is usually adopted for the fabrication of small AlSi10Mg alloy components, where Mg easily evaporates [46]. If the VPPAbased additive manufacturing is used, element loss from the bead can be suppressed.…”
Section: The Influences Of Energy Transfer On the Keyhole Temperature...mentioning
confidence: 99%
“…Various techniques are attempted to envisage the kerf size deviation of the laser micromachined Ti alloy (Ti-6Al-4V) sheet. The rise in laser frequency appreciably increases the kerf size and the deviations are decreased by introducing gas pressure [35]. Copper and its alloys are most often used in the micro-domain applications of personal computing and telecom industries.…”
Section: Introductionmentioning
confidence: 99%