Modeling of ultrasonic processing

Roylance, Margaret; Player, John; Zukas, Walter; Roylance, David

doi:10.1002/app.20595

Cited by 10 publications

(8 citation statements)

References 6 publications

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“…A number of investigators have modeled ultrasonic welding of polymers. [23][24][25] However, the modeling of ultrasonic welding of metals and alloys began only recently, with the development of emerging new technology that employs ultrasonic welding in ultrasonic consolidation. [26,27] The weld strength of ultrasonic welding was modeled and an empirical model was derived on the basis of the theory of surface and volume effects by Kong et al [28] A two-dimensional spot-welding model for the mechanical field was also constructed and the variation of friction coefficient was measured and studied by Gao and Doumanidis.…”

Section: Introductionmentioning

confidence: 99%

A Coupled Thermal-Mechanical Analysis of Ultrasonic Bonding Mechanism

Zhang

2009

Metall Mater Trans B

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A three-dimensional (3-D) finite element model has been developed to simulate the coupled thermal-mechanical fields in ultrasonic welding of aluminum foils. Transient distributions and evolution of the in-process variables, including normal stress, shear stress, slide distance, heat generation, temperature, and plastic deformation on the contact interface, and their interactions have been studied in detail. The von Mises plastic strain from the simulation has been correlated with the measured bonded area of ultrasonic joints. A possible mechanism for ultrasonic bond formation is proposed. The severe, localized, plastic deformation at the bond region is believed to be the major phenomenon causing bond formation in ultrasonic welding.

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Section: Introductionmentioning

confidence: 99%

A Coupled Thermal-Mechanical Analysis of Ultrasonic Bonding Mechanism

Zhang

2009

Metall Mater Trans B

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“…Before performing detailed consolidation and microstructural analyses to quantify void content according to US parameters, qualitative and quantitative assessments were carried out to identify an adequate processing window to maintain prepreg integrity. 11,13 Experiments were performed according to Figure 2(a).…”

Section: Resultsmentioning

confidence: 99%

“…It is expected that US vibrations on CF/epoxy prepreg layers will increase temperature in the thermoset through frictional and viscoelastic heating, promoting resin flow, compaction, and potentially, polymerization. 11 Using this technique, the debulking and vacuum-bagging process would no longer be necessary, saving time during the manufacturing process. In order to assess the feasibility of US-assisted repair, experiments were carried out on prepreg layer configurations without and with parent laminates.…”

Section: Introductionmentioning

confidence: 99%

“…US tape lamination was originally developed for cryo-tank manufacturing based on automated fiber placement or filament winding. 11,12 It was shown effective in debulking B-staged thermoset prepregs, leading to sufficient temperature increase to induce flow and consolidation. The US vibrations were shown to mainly generate localized viscoelastic heating, increasing temperature above standard cure values within a few seconds, but without significantly increasing the degree of cure (DOC).…”

Section: Introductionmentioning

confidence: 99%

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High-speed consolidation and repair of carbon fiber/epoxy laminates through ultrasonic vibrations: A feasibility study

Hoskins

Palardy

2020

Journal of Composite Materials

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Ultrasonic welding is a common fusion bonding technique to join unreinforced and reinforced thermoplastics. It is expected that applying ultrasonic vibrations to thermoset prepregs can produce heat generation to promote resin flow and consolidation. This paper discusses the feasibility of using ultrasonic vibrations as a high-speed repair technique for carbon fiber/epoxy prepregs to replace the traditional vacuum-bagging scarf setup. Three material types were investigated: out-of-autoclave unidirectional and plain weave prepregs (Cycom® 5320) and a general purpose twill weave prepreg (AS4/Newport 301). Two welding modes were considered: time and travel (vibrations stop once the desired vertical displacement is reached). For each mode, vibration time, travel, force, and amplitude were investigated. Cross-sectional analysis showed that void content equal to or below the vacuum-bagged samples could be achieved with ultrasonic consolidation to meet aerospace standards (≤2%). The following ultrasonic parameters were recommended to preserve prepreg tows integrity and minimize void content: vibration time below 1.0 s, travel between 12.5% and 50% of sample's initial thickness, force equal to or below 100 N, and amplitude below 41.3 μm. Temperature values recorded during the ultrasonic process reached the manufacturer's cure temperature range (120℃ to 180℃), with a predicted maximum degree of cure of 0.24. Interlaminar shear strength values were comparable for ultrasonically consolidated and vacuum-bagged samples. Soft and hard repair patches were applied to open-hole tensile coupons, with up to 50% strength recovery for both repair methods. Overall, ultrasonic consolidation has potential as a time- and cost-efficient repair method for thermoset prepregs.

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“…5 In addition, ultrasonic vibration-assisted forming processes have recently been conducted using amorphous materials such as polymers, composites, and glasses. Roylance et al 6 applied ultrasonic vibration in generating pressure and producing heat to cure fiber-reinforced thermoset polymer composites. Subsequently, they formulated a numerical simulation method to understand and improve the process.…”

Section: Ultrasonic Vibration-assisted Hot Glass Embossing Processmentioning

confidence: 99%

Modeling the Embossing Stage of the Ultrasonic‐Vibration‐Assisted Hot Glass Embossing Process

Nguyen

Hao

et al. 2014

Int J of Appl Glass Sci

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Ultrasonic vibration technology has recently been applied in high‐temperature forming processes, such as hot upsetting and hot glass embossing. Experimental research has delineated the effects of ultrasonic vibration on reducing required forces and improving the formability of materials. The purpose of this study was to construct a finite element model of the embossing stage of the ultrasonic vibration‐assisted hot glass embossing process. Traditional hot embossing experiments in which the embossing speed and temperature were varied were performed to calculate the viscoelastic dissipation caused by ultrasonic vibration, and this value was then inputted into the simulation. The consistency of the force responses in the experiments and simulation indicated that the proposed model is valid. The findings indicate that the influences of parameters such as the vibration frequency, vibration amplitude, and embossing speed on the ultrasonic vibration‐assisted hot glass embossing process must be investigated further.

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Modeling of ultrasonic processing

Cited by 10 publications

References 6 publications

A Coupled Thermal-Mechanical Analysis of Ultrasonic Bonding Mechanism

A Coupled Thermal-Mechanical Analysis of Ultrasonic Bonding Mechanism

High-speed consolidation and repair of carbon fiber/epoxy laminates through ultrasonic vibrations: A feasibility study

Modeling the Embossing Stage of the Ultrasonic‐Vibration‐Assisted Hot Glass Embossing Process

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