Modeling the mechanical behavior of heterogeneous ultrafine grained polycrystalline and nanocrystalline FCC metals

Abdul–Latif, A.; Miad, Abdelhamid Kerkour-El; Baleh, R.; Garmestani, Hamid

doi:10.1016/j.mechmat.2018.07.002

Cited by 10 publications

(2 citation statements)

References 75 publications

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“…In this setting Mareau and Berbenni (2015) proposed to linearize the non-linear viscous response in a tangent way (Molinari et al (1987)) to model the response of polycrystalline metals via a self-consistent scheme and compared the predictions to FFT results; 4. formulations based on the additive tangent interaction rule (Molinari et al (1997), Molinari (2002)). Abdul-Latif et al (2018) adopted this interaction law, although simplified by use of the isotropic Hill tensors, to simulate ultrafine grained polycrystalline and nanocrystalline copper. A finite strain version of the additive law combined with a self-consistent scheme was developed by Wang et al (2010a).…”

Section: Introductionmentioning

confidence: 99%

Cyclic response of electrodeposited copper films. Experiments and elastic–viscoplastic mean-field modeling

Girard

Frydrych

Kowalczyk-Gajewska

et al. 2021

Mechanics of Materials

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The goal of the present work is to identify and model the elastic-viscoplastic behavior of electrodeposited copper films under tension-compression loadings. From the experimental point of view, as proposed in the literature, a film of copper is electrodeposited on both sides of an elastic compliant substrate. The overall specimen is next subjected to tensile loading-unloadings. As the substrate remains elastic, the elastic-plastic response of copper under cyclic loading is experimentally determined. A clear kinematic hardening behavior is captured. To model the mechanical response, a new elastic-viscoplastic self-consistent scheme for polycrystalline materials is proposed. The core of the model is the tangent additive interaction law proposed in (Molinari, 2002). The behavior of the single grain is rate dependent where kinematic hardening is accounted for in the model at the level of the slip system. The model parameters are optimized via an evolutionary algorithm by comparing the predictions to the experimental cyclic response. As a result, the overall response is predicted. In addition, the heterogeneity in plastic strain activity is estimated by the model during cyclic loading.

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Section: Introductionmentioning

confidence: 99%

Cyclic response of electrodeposited copper films. Experiments and elastic–viscoplastic mean-field modeling

Girard

Frydrych

Kowalczyk-Gajewska

et al. 2021

Mechanics of Materials

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“…By coupling plasticity to martensitic phase transformation, Sadjadpour et al (2015) extended a thermo-mechanical model to investigate the dynamic shear deformation. Recently, by means of a self-consistent method, Abdul-Latif et al (2018) developed a model to describe the mechanical response of heterogeneous ultrafine grained and nanocrystalline FCC metals. Ziaei and Zikry (2019) understood the aggregate behavior of multi-phase crystalline by combining microstructural interactions with the dislocation-density framework.…”

Section: Introductionmentioning

confidence: 99%

Hierarchical-microstructure based modeling for plastic deformation of partial recrystallized copper

Liu

Cai

et al. 2019

Mechanics of Materials

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Hierarchical microstructure in partial recrystallized materials can simultaneously improve the strength and ductility of metallic materials. Modeling the mechanical behavior of partial recrystallized materials helps to process materials with superior combination of ductility and strength. Here, using experimental characterization, cellular automation (CA) and finite element method, hierarchical-microstructure based modeling was proposed to simulate the tensile deformation of partial recrystallized copper. Firstly, partial recrystallized coppers with different volume fractions of recrystallization were produced by means of extrusion machining and subsequent heat treatment (HT). Uniaxial tensile tests and microstructural observations show that the hierarchical-microstructure of recrystallized grains (RGs) surrounded by elongated subgrains has a significant effect on the mechanical properties. Then, based on the experimental results, a hierarchical-microstructure based plasticity model was developed to describe the yield surface of partial recrystallized materials. CA was further employed to simulate the hierarchical microstructure. By embedding the plasticity model and simulated hierarchical-microstructure in finite element method, a finite element model (FEM) for mechanical behavior of partial recrystallized copper was proposed, where the elongated subgrain with forest dislocation and low angle grain boundary, the RG with few dislocations and twin boundary, and volume fraction of recrystallization were taken into consideration. Finally, the experimental data and the comparison with the conventional plasticity model validate the rationality of the proposed model.

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In Situ Atomic‐Scale Experiments Reveal the Atomistic Mechanisms of Grain Boundary Plasticity

Zhang,

Feng,

Zhang

et al. 2024

Adv Funct Materials

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Grain boundary (GB) plastic deformation is a critical deformation mode that can significantly affect the microstructure and mechanical properties of metals. Given its importance, numerous studies have been conducted over the past few decades to investigate the atomistic mechanism of GB plasticity, which includes GB migration, GB sliding, and grain rotation. These three deformation modes typically occur simultaneously and interact cooperatively. Despite substantial advancements in understanding the atomic‐scale mechanisms of GB plasticity, there is a scarcity of review papers addressing the in situ atomic‐scale mechanisms of GB plasticity. This work aims to provide a comprehensive overview of the atomistic mechanisms of GB plasticity in metals, detailing modes predicted by theoretical models and molecular dynamics (MD) simulations, as well as discussing mechanisms verified by in situ atomic‐scale experiments. Additionally, it examines the factors influencing GB deformation. The authors intend for this review to serve not only as a valuable resource for researchers in the field of nanocrystalline (NC) metals but also as a textbook for educating graduate students.

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Modeling the mechanical behavior of heterogeneous ultrafine grained polycrystalline and nanocrystalline FCC metals

Cited by 10 publications

References 75 publications

Cyclic response of electrodeposited copper films. Experiments and elastic–viscoplastic mean-field modeling

Cyclic response of electrodeposited copper films. Experiments and elastic–viscoplastic mean-field modeling

Hierarchical-microstructure based modeling for plastic deformation of partial recrystallized copper

In Situ Atomic‐Scale Experiments Reveal the Atomistic Mechanisms of Grain Boundary Plasticity

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