Modelling and experimental investigation of temperature field during fly-cutting of KDP crystals

Li, Chen; Piao, Yinchuan; Hu, Yuxiu; Wei, Zongze; Li, Longqiu; Zhang, Feihu

doi:10.1016/j.ijmecsci.2021.106751

Cited by 24 publications

(8 citation statements)

References 44 publications

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“…Cutting-edge radius (CER) affects the cutting force [1], cutting temperature [2], and surface integrity of parts [3]. Therefore, many scholars are engaged in cutting force analysis and modeling [4][5][6][7][8][9].…”

Section: Introductionmentioning

confidence: 99%

“…In addition, some scholars analyzed the effect of cutting force based on elastic-plastic interactions. Chen et al [7] established a theoretical model considering the elastic, plastic, and brittle zones. Error factors are inevitable during the cutting process, Wojciechowski et al [8] developed a milling force model that considers the geometry errors of machining system.…”

Section: Introductionmentioning

confidence: 99%

“…Unfortunately, the research of [4][5][6][7] ignored the influence of CER. During the early development of cutting processes, it was assumed that the cutting edge was sharply acceptable for large-scale cutting because the CER was much smaller than the undeformed chip thickness [11].…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Numerical Modeling of the Effect of Cutting-Edge Radius on Cutting Force and Stress Concentration during Machining

Chang

2022

Micromachines

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Cutting is the primary method of material removal, and the quality of machined parts depends on the geometry of cutting tools. In this paper, a new cutting force coefficient model is established, revealing the influence of cutting-edge radius on the cutting process. The effects of cutting-edge radius on the shear angle and cutting force components are analyzed by finite element simulations. A series of simulations is conducted, and the results show that with increased cutting-edge radius, the shear angle decreases nonlinearly, and the cutting force increases gradually. Additionally, the growth rate of the feed force caused by increasing the cutting-edge radius is higher than that of the tangential force. Furthermore, the stress concentration area of the machined surface extends from the surface to the subsurface as the cutting-edge radius increases. The results of this research show that changing the cutting edge affects the cutting force component, shear angle, and stress concentration range during the cutting process. These results provide a theoretical reference for predicting the residual stress in parts.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Numerical Modeling of the Effect of Cutting-Edge Radius on Cutting Force and Stress Concentration during Machining

Chang

2022

Micromachines

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“…Chip morphologies are compared in the X-axis and Z-axis views, which show that the chip formation process can be predicted by the simulation well enough. In other studies, it was demonstrated that errors of about 10% between the experimental and simulation results are acceptable [78,79]. Therefore, the thermomechanical coupled model developed in…”

Section: Comparison Of Experimental Results and Simulation Resultsmentioning

confidence: 94%

Cutting mechanics and efficiency of forward and reverse multidirectional turning

Cai

Zhang

et al. 2023

International Journal of Mechanical Sciences

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“…Abrasive machining, as one of the non-traditional machining technologies, is a process to remove material by means of micro-ploughing, micro-cutting, micro-fatigue and micro-cracking, and has been extensively used to machine almost any material, particularly hard brittle materials [4][5][6][7]. Currently, the flat substrates of hard brittle materials, like RB-SiC ceramics, are usually prepared by using the abrasive lapping and polishing processes [8,9], and to ensure the machining efficiency and quality, the optimization of processing parameters is necessary by conducting and repeating associated experiments many times, which is to some extent time-consuming and expensive. The single abrasive scratching test is considered one of the effective ways to investigate the fundamental of material removal mechanisms and provides good references for the abrasive machining process [10][11][12][13].…”

Section: Introductionmentioning

confidence: 99%

Surface Morphology Evaluation and Material Removal Mechanism Analysis by Single Abrasive Scratching of RB-SiC Ceramics

You

Yuan

et al. 2022

Crystals

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Reaction-Bonded Silicon Carbide (RB-SiC) ceramics possessing excellent mechanical and chemical properties, whose surface integrities have an essential effect on their performance and service life, have been widely used as substrates in the core parts of aerospace, optics and semiconductors industries. The single abrasive scratching test is considered as the effective way to provide the fundamental material removal mechanisms in the abrasive lapping and polishing of RB-SiC ceramics for the best surface finish. In this study, a novel single abrasive scratching test with an increasing scratching depth has been properly designed to represent the real abrasive lapping and polishing process and employed to experimentally investigate the surface integrity regarding different scratching speeds. Three typical and different material removal stages, including the ductile mode, ductile–brittle transition mode and brittle mode, can be clearly distinguished and it is found that in the ductile material removal stage by increasing the scratching speed would inhibit the plastic deformation and improve its surface integrity. It is also found that in the ductile–brittle transition and brittle material removal stages, to increase the scratching speed would inhibit the plastic deformation due to the fast scratching speed that limits the time of plastic deformation on the target, but it also results in the increased length of lateral cracks with the increased scratching speed which can reflect that the size of brittle chips, like brittle fractures and large grain fragmentations, increases as the scratching speed increases. It can provide the references for the optimization of the abrasive lapping and polishing of RB-SiC ceramics with high efficiency and surface quality.

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Modelling and experimental investigation of temperature field during fly-cutting of KDP crystals

Cited by 24 publications

References 44 publications

Numerical Modeling of the Effect of Cutting-Edge Radius on Cutting Force and Stress Concentration during Machining

Numerical Modeling of the Effect of Cutting-Edge Radius on Cutting Force and Stress Concentration during Machining

Cutting mechanics and efficiency of forward and reverse multidirectional turning

Surface Morphology Evaluation and Material Removal Mechanism Analysis by Single Abrasive Scratching of RB-SiC Ceramics

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